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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

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    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

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    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
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Bourns Expands its Resettable Fuse Line with Higher Power Rating

19.12.2023
Reading Time: 3 mins read
A A

Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced it is expanding its Multifuse® Polymer PTC (PPTC) Resettable Fuse Model MF-ASML/X Series with a new higher power rated model.

The Bourns® Model MF-ASML075/6 features a maximum 0.75 A (Ihold) rating and is designed to give developers of space-constrained applications greater overcurrent/overtemperature protection selection options in an ultra-compact 0402 footprint.

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Bourns Releases Power Resistor Adds Reverse-Pin Configuration

In addition to the higher hold current and smaller footprint, the new model incorporates several key improvements, including increased voltage ratings (Vmax) and enhanced resistance stability. These enhancements are specifically crafted to cater to a wide array of applications, primarily as optimized protection solutions for low voltage DC ports commonly found in consumer products such as wearables, toys and gaming applications.

As the latest addition to the Multifuse® PPTC Resettable Fuse line, the Model MF-ASML075/6 is also based on Bourns’ innovative freeXpansion™ technology. Developed more than 14 years ago, freeXpansion™ technology increases the performance of the fuse with the ability to handle higher currents and voltages, improves its resistance stability and allows for a smaller footprint.

To help increase the reliability and longevity of all Multifuse® PPTC Resettable Fuses, including the MF-ASML/X model family, Electroless Nickel Immersion Gold (ENIG) plating is employed for their SMD terminals. ENIG plating uses a thin, uniform layer of gold over a layer of nickel that has been proven to offer outstanding corrosion resistance and excellent electrical conductivity. In contrast, traditional nickel-tin (Ni/Sn) plating can be susceptible to issues such as whisker formation, oxidation, and corrosion, which can lead to short circuits, subpar soldering and deterioration in electronic circuits.

The MF-ASML/X model family also adopts the unique Titanium carbide (WC) material, which features a lower resistance and is oxidation resistant in humid environments. A lower resistance is valuable because it contributes to higher power efficiency, while oxidation resistance aids in achieving an enhanced quality and reliability level.

Features

  • Standard 0402 footprint
  • Fast Time-to-Trip (TTT) to protect in overcurrent events
  • Excellent solderability with ENIG terminal
  • Symmetrical design and low profile of 0.6 mm
  • RoHS compliant and halogen free

Applications

  • Overcurrent and overtemperature protection for:
    • USB, HDMI port protection
    • Battery packs
    • Tablet and laptop PCs
    • Hard disk drives
    • LCD/LED HDTV
    • Server and data center interfaces

Related

Source: Bourns

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