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Beyond 85/85 Lifetime Estimation of PP Film Capacitors in Humid Environments

Life Cycle Assessment of a Graphene-Based Supercapacitor

Pure-Polyimide Flexible Heater for High-Reliability Applications

Samsung Electro-Mechanics Unveils Ultra-High-Capacitance MLCCs for AI Servers

Advancements in Flexible End Terminations for Robust MLCCs in EV

Lifetime Assessment for Capacitors in EPS Application

Passive Components J-STD-075 Process Sensitivity Level Classification And Labeling

New EPN Dielectric Film Capacitors Featuring High Temp and Power Density

E-Textile SMD-Ribbon Joints Protections Against Sweat
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Ripple Steering in Coupled Inductors: SEPIC Case

SEPIC Converter with Coupled and Uncoupled Inductors

Coupled Inductors in SEPIC versus Flyback Converters

Non-Linear MLCC Class II Capacitor Measurements Challenges

Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

How to Calculate the Output Capacitor for a Switching Power Supply

Switched Capacitor Converter Explained

Understanding Inductor Dot Markings and Their Application in LTspice
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Resistors

E-Textile SMD-Ribbon Joints Protections Against Sweat

25.9.2025

Applications e-Blog

NTC/PTC Thermistors LTSpice Simulation; Vishay Video Part I

24.8.2022

1.3k

This video explains the Vishay approach in relation with electronic simulation with thermistors and shows partner platforms where users can...

24.8.2022

Most low value current sense resistors produce stray voltages due to the Seebeck effect. These stray voltages or thermal EMF...

10.6.2021

469

Miniaturization has long been “en vogue” when it comes to multi-layer ceramic chip capacitors. But downsizing is no trivial process,...

8.6.2021

Passive components are often one of the last things engineers consider, but in today’s fast-moving automotive electronics design environment, choosing...

Figure 1: Inductor Using Ferrite and Iron Powder Technology; source: Chillisin

2.6.2021

Space on a PCB is in short supply, but the demands placed on the technical properties of inductive components continue...

The new interposer design with an embedded capacitor provides a notable reduction in area requirements and interconnect length, leading to lower wiring resistance and parasitic capacitance. MPU: Microprocessing unit; DRAM: Direct random-access memory. Credit: The 2021 IEEE Electronic Components and Technology Conference

2.6.2021

521

Scientists at Tokyo Institute of Technology develop a 3D functional interposer -the interface between a chip and the package substrate--containing...

31.5.2021

130

The presentation explains our design considerations for Single Pair Ethernet on the PCB and shows latest measurements for different filter...

31.5.2021

1. A Primer on Aluminum Electrolytic Capacitors The development of the electrolytic capacitor (e-cap) has been one of the main...

8.8.2022

Noise suppression has become an important issue, particularly with regard to electromagnetic interference (EMI) and electromagnetic compatibility (EMC). In this...