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YAGEO Introduces 310VAC SMD Y2 Safety MP Capacitors for Compact EMI Filtering

DMASS: European Components Distribution Returns To Growth In Q1 2026

German Component Distribution Market Rebounds in Q1 2026 According to FBDi

Nippon Chemi-Con Announces New Capacitor series for AI, Automotive and Immersion Cooling

Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design

Molex Expanded AirBorn SInergy Hybrid Connectors with 25 A Power Modules

Murata Expands Ansys Simulation Models for RF inductors, MLCCs, and Power Inductors

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Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

Current Sense Transformer Datasheet and Design‑in Guide

Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

Magnetics Design in High‑Frequency GaN Converters

Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

Two‑capacitor paradox explained for engineers

Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

Tapped Inductor Buck Converter Fundamentals
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Capacitors

Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design

16.6.2026

e-PassiveBlog

MLCC Selection Guide – Don’t Blindly Leave Component Choices to Tools

10.6.2021

633

Miniaturization has long been “en vogue” when it comes to multi-layer ceramic chip capacitors. But downsizing is no trivial process,...

9.6.2021

153

TDK Corporation presents the new, powerful and intuitive CLARA tool (Capacitor Life And Rating Application) for calculating and selecting EPCOS...

11.8.2025

A list of electrical or electronic devices using connectors would be long and varied both in function and construction. At...

8.6.2021

Passive components are often one of the last things engineers consider, but in today’s fast-moving automotive electronics design environment, choosing...

Figure 1: Inductor Using Ferrite and Iron Powder Technology; source: Chillisin

2.6.2021

Space on a PCB is in short supply, but the demands placed on the technical properties of inductive components continue...

The new interposer design with an embedded capacitor provides a notable reduction in area requirements and interconnect length, leading to lower wiring resistance and parasitic capacitance. MPU: Microprocessing unit; DRAM: Direct random-access memory. Credit: The 2021 IEEE Electronic Components and Technology Conference

2.6.2021

706

Scientists at Tokyo Institute of Technology develop a 3D functional interposer -the interface between a chip and the package substrate--containing...

31.5.2021

152

The presentation explains our design considerations for Single Pair Ethernet on the PCB and shows latest measurements for different filter...

31.5.2021

1. A Primer on Aluminum Electrolytic Capacitors The development of the electrolytic capacitor (e-cap) has been one of the main...

26.5.2021

300

This video explains what a 3D silicon capacitor is. It shows its main benefits in terms of performances and miniaturization....

8.8.2022

Noise suppression has become an important issue, particularly with regard to electromagnetic interference (EMI) and electromagnetic compatibility (EMC). In this...