TPC Technical Program Committee of the next 3rd PCNS Passive Components Networking Symposium scheduled for Sep 7-10th 2021 in Milano,...
Read moreA team led by Technical University of Munich (TUM) physicists Christoph Utschick and Prof. Rudolf Gross has succeeded in making...
Read moreThere is an on-going interest from space industry to accommodate commercial EEE components in space systems. The attention is especially...
Read moreTPC Technical Program Committee of the next 3rd PCNS Passive Components Networking Symposium scheduled for Sep 7-10th 2021 in Milano,...
Read moreOn February 18th, 2021 in a kick-off meeting opened by The Ambassador of Norway in Norway, Her Excellency Mrs. Else...
Read moreA new consortium funded by an award from the U.S. Department of Defense has selected Purdue University to co-lead its...
Read moreExxelia, a leading manufacturer of complex passive components and sub-systems dedicated to harsh environments, launches the Cubisic SLP product series,...
Read more24th annual CMSE Components for Military & Space Electronics virtual conference that will be held April 19-23, 2021 announced agenda...
Read moreWith the increasing use of low-voltage, high-current loads such as FPGAs within spacecraft avionics, engineers are increasingly having to design-in...
Read moreVishay Intertechnology introduces a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) with a lead (Pb)-bearing termination finish suitable...
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