On February 18th, 2021 in a kick-off meeting opened by The Ambassador of Norway in Norway, Her Excellency Mrs. Else...
Read moreDetailsA new consortium funded by an award from the U.S. Department of Defense has selected Purdue University to co-lead its...
Read moreDetailsExxelia, a leading manufacturer of complex passive components and sub-systems dedicated to harsh environments, launches the Cubisic SLP product series,...
Read moreDetails24th annual CMSE Components for Military & Space Electronics virtual conference that will be held April 19-23, 2021 announced agenda...
Read moreDetailsWith the increasing use of low-voltage, high-current loads such as FPGAs within spacecraft avionics, engineers are increasingly having to design-in...
Read moreDetailsVishay Intertechnology introduces a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) with a lead (Pb)-bearing termination finish suitable...
Read moreDetailsPCNS Passive Components Networking Symposium organizing committee is pleased to announce Call for Papers for the 3rd international symposium dedicated...
Read moreDetailsAlexander Teverovsky, Jacobs Engineering, Inc, NASA GSFC published presentation that provides a comparative analysis of degradation processes, failure modes and...
Read moreDetailsSERMA Microelectronics, a subsidiary of SERMA Group, finalised the purchase of TFP (THIN FILM PRODUCTS), the French leader in the...
Read moreDetailsCornell Dubilier Electronics, Inc. announced today that its subsidiary, CD Snow Hill, LLC, has acquired the capacitor producing assets of...
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