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Bourns Release Automotive 4-Terminal Shunt Resistors

Bourns Releases High Inductance Common Mode Choke

Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

KYOCERA AVX Expands Stacked MLCC Capacitors Offering

Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

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Connector PCB Design Challenges

Efficient Power Converters: Duty Cycle vs Conduction Losses

Ripple Steering in Coupled Inductors: SEPIC Case

SEPIC Converter with Coupled and Uncoupled Inductors

Coupled Inductors in SEPIC versus Flyback Converters

Non-Linear MLCC Class II Capacitor Measurements Challenges

Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

How to Calculate the Output Capacitor for a Switching Power Supply
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inter-connect news

KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

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Understanding Gold Embrittlement in Solder Joints

This article explains gold embrittlement issues and how to avoid it. Gold has long been revered in the electronics industry...

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© EPCI - Leading Passive Components Educational and Information Site