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    TDK and TAIYO YUDEN business alliance announcement for advanced MLCCs and inductors supporting AI infrastructure.

    TDK and TAIYO YUDEN Explore Alliance for MLCCs and Inductors

    Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

    Antiferroelectric Hafnia at the 2D Limit

    Bourns UALH Series aluminum housed high-power wirewound resistor in a thin rectangular metal enclosure

    Bourns Wirewound Resistors Target 100 W Industrial Designs

    Coilcraft CSX7045 surface-mount current sense transformers with compact chip-style package

    Coilcraft Extends Current Sense Transformers with 1.8 kVrms Isolation

    Metallized film capacitor winding with PEN, PET and polypropylene dielectric film layers shown in a power-electronics supply-chain concept

    PEN Film Supply Challenges and Capacitor Replacement Paths

    Wk 37 Electronics Supply Chain Digest

    Vishay Sfernice D2TO and DTO thick-film SMD power resistor sample kits with TO-263 D2PAK and TO-252 DPAK devices

    Vishay SMD Power Resistor Sample Kits for High-Power Design

    schurter-tcsv4-side-actuated-smt-tactile-switch

    SCHURTER Introduces Side-Actuated SMT Tactile Switch

    TLVR multiphase coupled inductors, auxiliary ballast inductor

    TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

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    TDK and TAIYO YUDEN business alliance announcement for advanced MLCCs and inductors supporting AI infrastructure.

    TDK and TAIYO YUDEN Explore Alliance for MLCCs and Inductors

    Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

    Antiferroelectric Hafnia at the 2D Limit

    Bourns UALH Series aluminum housed high-power wirewound resistor in a thin rectangular metal enclosure

    Bourns Wirewound Resistors Target 100 W Industrial Designs

    Coilcraft CSX7045 surface-mount current sense transformers with compact chip-style package

    Coilcraft Extends Current Sense Transformers with 1.8 kVrms Isolation

    Metallized film capacitor winding with PEN, PET and polypropylene dielectric film layers shown in a power-electronics supply-chain concept

    PEN Film Supply Challenges and Capacitor Replacement Paths

    Wk 37 Electronics Supply Chain Digest

    Vishay Sfernice D2TO and DTO thick-film SMD power resistor sample kits with TO-263 D2PAK and TO-252 DPAK devices

    Vishay SMD Power Resistor Sample Kits for High-Power Design

    schurter-tcsv4-side-actuated-smt-tactile-switch

    SCHURTER Introduces Side-Actuated SMT Tactile Switch

    TLVR multiphase coupled inductors, auxiliary ballast inductor

    TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

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CMSE Components for Military & Space Electronics 2024 Call for Presentations

21.2.2024
Reading Time: 3 mins read
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The 27th Annual CMSE Conference and Exhibition is accepting presentations for April 30th -May 2nd 2024 event in Los Angeles. Deadline for presentation abstracts have been extended to March 1st 2024.

Components for Military & Space Electronics Conference and Exhibition (CMSE) is the premier event focused on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military, as well as commercial, civilian, and military space systems.

RelatedPosts

CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

CMSE 2024: Technical Program Announced

CMSE 2022 Call for Papers Deadline Extended

A conference experience focused on high quality technical talks, keynotes and panel discussions that foster maximum attendee participation/interaction and furthers our collective understanding of the technical challenges faced in our industry. Showcase the supplier base to the greatest extent possible. Educate the industry, especially young component engineers, in order to secure the future defense of our country.

Call for Presentations
We request presentation outlines at CMSE 2024 on topics such as:

  • Integration of next gen 2.5/3D FOWL packaging into mil systems
  • Non-Hermetics: Class P, Class Y and COTS for Hi Rel missions
  • Leveraging automotive parts for military and space
  • Selection and approval process for PEMS/COTS
  • Hermetics: IGA (TM 1018) moisture issues, TM 1014 testing and getters
  • EEE parts engineering issues for small satellites
  • PME/BME MLCCs and MIL-PRF stacked caps
  • Supercapacitors and high CV for high rel applications
  • Transient response of passive components
  • Ultra-thin embedded passives to enable circuit miniaturization
  • Tantalum polymer progression towards space and wear out
  • GaN and SiC for RF and power management
  • AI tools and digital engineering/model-based design
  • Continuity of the electronics supply chain
  • Counterfeits, trust, and security issues in supply chain management
  • Long term dormant storage (Hermetic vs. Non-Hermetic)
  • CHIPS for America act securing our DOD Industrial base

Extended Deadline for Submission: March 1st 2024

Presentations are 15 minutes with 5 minutes of Q & A. The CMSE committee does not require a formal paper submission. You decide how much of the presentation material to provide the attendee. The idea is to promote sharing of basic scientific and technical information about common problems faced by both the component manufacturer and the system OEMs in the Aerospace industry.

Download the Call for Presentations form and submit yours today!

CMSE Attendee and Exhibitor Pass Options

Related

Source: TJ Green Associates LLC

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