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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

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    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

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    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Trending Tags

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Coilcraft Introduces New Series of High Inductance Power Inductors.

19.3.2019
Reading Time: 1 min read
A A

Source: RF design news

Coilcraft introduces new XAL7050 series of high inductance power inductors. With up to 47 µH inductance, current ratings up to 5.5 Amps, low DCR, & soft saturation, they’re perfect for VRM/VRD applications.

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Performance

  • High current and very low DCR
  • Soft saturation makes them ideal for VRM/VRD applications.
  • AEC-Q200 Grade 1 qualified (–40°C to +125°C ambient)
  • Core material: Composite
  • Environmental RoHS compliant, halogen free
  • Terminations: RoHS compliant tin-silver (96.5/3.5) over copper. Other terminations available at additional cost.
  • Weight: 1.50 – 1.55 g
  • Operating voltage: 0 – 55 V
  • Ambient temperature: –40°C to +125°C with (40°C rise) Irms current.
  • Maximum part temperature: +165°C (ambient + temp rise) with derating.
  • Storage temperature Component: –55°C to +165°C. Tape and reel packaging: –55°C to +80°C
  • Resistance to soldering heat: Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
  • Moisture Sensitivity Level (MSL): 1 (unlimited floor life at 85% relative humidity)
  • Failures in Time (FIT) / Mean Time Between Failures (MTBF): 38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332
  • Packaging: 250/7″ reel, 1000/13″ reel Plastic tape: 16 mm wide, 0.40 mm thick, 12 mm pocket spacing, 5.21 mm pocket depth
  • PCB washing: Tested to MIL-STD-202 Method 215 plus an additional aqueous wash

 

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