Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Electronic Component Prices Increase in Q1 2022

4.5.2022
Reading Time: 4 mins read
A A

Electronic component prices are on the rise including both semiconductor and passive components due to increase in raw material, energy and logistic costs reports EPS News article.

In Q2, STMicroelectronics announced a 15 percent price increase affecting all product lines from April onward, due to surmounting raw material, energy and logistic costs, according to distributor Fusion Worldwide’s monthly Greensheet report.

RelatedPosts

Bourns Releases Compact High Current Shielded Power Inductors

March 2026 Interconnect, Passives and Electromechanical Components Market Insights

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

In May, an additional price increase of 25 percent to 30 percent will apply to STMicro’s discontinued STM8 (8-bit) MCU series. The series will be dropped by Q3 and will lead to customers to the alternative STM32 (32-bit) series. However, the STM32 has been impacted by delivery delays and will require customers to redesign their boards to accommodate the part. For all series, deliveries are delayed to Q4 2022 or Q1 2023, Fusion reports.

Microchip has implemented a wide range of price increases between 5 percent to 40 percent across the board, with an average increase of 10 percent. Lead times are currently up to 50 weeks and any new orders are required to be no cancel, no return (NCNR) with a one-year delivery window, Fusion added.  There have been numerous instances where participation in Microchip’s Preferred Supplier Program has not guaranteed full allocation, with shortfalls as high as 50 percent reported, according to the distributor, suggesting gaps in supply are much higher for non-participants.

However, there was an apparent price drop on Intel server CPUs when the Chinese government mandated lockdowns at Shenzhen factories in March due to Covid-19, Fusion added. This is likely due to vendors actively reducing inventory of existing Intel Cascade Lake and Cascade Lake Refresh supply.

In January, passives component manufacturer Omron raised prices of system control products by 15 percent and the prices of inverters, safety products, application sensor products, electrical components, industrial relays and industrial switches by 10 percent.

Activity in Q4

The fourth quarter of 2021 saw its share of price hikes. Chip makers Silicon Labs and Renesas notified customers of price increases. TE Connectivity, a supplier of interconnect, passive and electromechanical (IP&E) devices, announced price hikes of between 5 and 10 percent. Interconnect manufacturer Molex raised prices by 7 percent and semiconductor maker Xilinx between 10 percent and 20 percent.

Across the board, component makers cited supply chain volatility as the main reason for the price hikes. Many tried to avoid raising prices by increasing efficiency, but most are investing to increase capacity. Silicon Labs noted unprecedented cost increases throughout its supply chain — raw materials, foundries test and assembly, logistics and labor.

The same pressures are extending lead times at unprecedented levels. Chip supplier Infineon’s lead times increased from an average of 48 weeks to 60 weeks. IP&E vendor Vishay Intertechnology’s lead times extend beyond one year, Fusion reported.

Operations at two Vishay factories in Shanghai, China have been impacted by mandated lockdowns and workforce restrictions due to Covid-19. One of the factories manufactures MOSFETs while the other makes diodes.

The quarantine restrictions at Vishay distribution and sorting factories affect both MOSFET and diode production, preventing customers from receiving orders. This is expected to create supply gaps well through April. Automotive MOSFET lead times are at 75 weeks; thin-film resistors at 50 weeks to 80 weeks; and shunt resistors at 80 weeks, Fusion reported.

On Semiconductor (Onsemi) lead times continue to surpass 50 weeks with no sign of improvement as production capacity is at its max for 2022, Fusion reported. Allocation levels also remain tight as priority is currently given to customers in the U.S. and EMEA. As prices for raw materials continue to increase, prices are also expected to rise in Q2.

Organizations need to recalibrate their plans and stock up on the components they need in a timely fashion that allows for unexpected shortages or delays in component production and delivery, Surenian notes. “In reality, this is incredibly difficult to do when company leaders don’t have access to an enterprise-wide, traceable digital supply chain thread that connects their demand plan with supply to understand the impact when prices and lead-times will skyrocket.”

Overall, semiconductor commitments from large customers stretch out past 52 weeks, according to researcher LevaData. Given that dynamic, there is less incentive to lower lead times. Given the recent events in Ukraine and the potential impact on the global supply of raw materials used in semiconductor production coming from either Russia or Ukraine, such as neon gas, hexaflurocyclobutene, and palladium, LevaData expects further pressure on lead time trends remaining at the current elevated levels for some time.

Related

Source: EPS News

Recent Posts

Bourns Releases Compact High Current Shielded Power Inductors

2.4.2026
1

March 2026 Interconnect, Passives and Electromechanical Components Market Insights

2.4.2026
7

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

1.4.2026
5

APEC 2026 Power Electronics Trends and Implications for Passive Components

1.4.2026
31

Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

1.4.2026
17

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

31.3.2026
20

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

31.3.2026
31

Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

30.3.2026
68

Samsung Introduces 35V MLCCs Flying Capacitors for USB PD Fast Charging

27.3.2026
29

Upcoming Events

Apr 8
17:00 - 18:00 CEST

Trade Secrets of the Flyback Converter

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version