Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Connector Design/Selection/Assembly

2.4.2025
Reading Time: 2 mins read
A A

This chapter will provide an overview of design and material requirements for contact finishes, contact springs and connector housings as well as the major degradation mechanisms for these connector components. Material selection criteria for each will also be reviewed.

Contact Finishes

RelatedPosts

Polymer Materials and Processing

What is RF Connector

Connector Materials and Processes

Contact Finish Requirements

As noted in Chapter I/1.2.3 Contact Finishes, a contact finish is applied to connector contact springs to provide two basic functions:
• to protect the copper alloy spring members from corrosion
• to optimize the mechanical and electrical performance of the contact interface.

As noted in Chapter I/1.2.2 Contact Springs, connector contact springs are generally made from copper alloys due to their combination of high electrical conductivity and formability at reasonable strength levels. Unfortunately copper alloys are susceptible to corrosion in environments containing oxygen, sulfur and chlorine, in other words typical connector operating environments. Thus, the first function of a contact finish is to protect the copper alloy spring from corrosion.

Corrosion protection can be provided by simply coating the contact spring with a material which is not susceptible to corrosion or, in connectors, a material which forms films which are self limiting in thickness and readily displaced mechanically during the mating of a connector. Gold is the prime example of the first case and tin of the second. Each of these cases will be discussed later in this chapter.

“Optimization” of contact interface performance is provided by influencing the corrosion and wear characteristics of the contact interface. Corrosion protection is necessary in order to ensure that metal-to-metal a-spot contact interfaces can be created and maintained as discussed in Chapter I/1.3.1 Overview. Recall that chapter. We also note that creating and maintaining a metal-to-metal interface is the prime goal of connector design. A gold-to-gold contact interface is intrinsically metal-to-metal because gold does not corrode. A tin-to-tin contact interface becomes metal-to-metal when the surface tin oxide is displaced on mating of the connector. There are some qualifications to this simple description that will be discussed later in this chapter.

“Optimization” of contact interface wear characteristics is particularly important with gold contact finishes. The concern is that the wear that occurs on each mating cycle can result in wear through of the contact plating exposing the underlying copper alloy which is then susceptible to corrosion. The wear performance of gold finishes can be improved by increasing the hardness of the gold by alloying and by increasing the effective hardness of the gold by using a nickel underplate.

Consider noble metal finishes first.

Related

Source: Wurth Elektronik

Recent Posts

Circular Connectors Coding

26.11.2025
66

Connector PCB Design Challenges

3.10.2025
71

Non-Magnetic Interconnects

23.4.2025
37

10 Tips for Ensuring Reliability of Discrete Wire Assemblies

20.2.2025
69

Polymer Materials and Processing

11.8.2025
121

Basic PCB Technology Overview

1.7.2025
34

What is RF Connector

17.12.2024
23

Creepage and Clearance of Connector

25.7.2025
45

Microwave Multi Line Connectors Mounting and Handling Precautions

11.8.2025
13

Upcoming Events

Feb 24
16:00 - 17:00 CET

Mastering Galvanic Isolation: Ensuring Safety in Power Electronics

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • 3-Phase EMI Filter Design, Simulation, Calculation and Test

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version