Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

    Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

    TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

    Passive Components for Next Gen Automotive Systems

    ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

    Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

    Circular Connectors Coding

    binder Presents Harsh Environment Connector for Outdoor Environments

    DigiKey Introduces Industry-First Power Supply Configuration Tool

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

    Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

    TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

    Passive Components for Next Gen Automotive Systems

    ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

    Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

    Circular Connectors Coding

    binder Presents Harsh Environment Connector for Outdoor Environments

    DigiKey Introduces Industry-First Power Supply Configuration Tool

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Effect of Burn-in Process on X7R MLCC Reliability

26.8.2022
Reading Time: 4 mins read
A A

The scientific paper on evaluation of effect of burn-in process on reliability of X7R multilayer ceramic capacitors has been published by Penn State researchers.

Base metal electrode (BME) multilayer ceramic capacitors (MLCCs) continue to advance with higher volumetric capacitance, higher voltage, and higher temperature operational ranges with greater numbers of capacitors being manufactured and integrated into the electronic infrastructure of society. Many of these applications range from aerospace, transport, computation, medical, satellite, military, and the internet of things means the interdependence of these devices require higher reliability at a collective and individual component level.

RelatedPosts

Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

Bourns Extends High Power Thick Film Resistors with Four New Series

Thus, determining the lifetime reliability of MLCCs is critical to provide more reliable components, and no weak links to the electrified infrastructure. For some of the more costly systems that support military and satellite systems, the reliability testing is very extensive.

Schematic of the electromigration of oxygen vacancies during MLCC capacitors burn-in process.

The burn-in test is a screening procedure used to remove components with higher probability of infant mortality failures. In this process, components are exposed to high temperatures and voltages relative to their design. The thermal stimulated depolarization current results revealed that burn-in test caused the intragranular and transgranular migration of oxygen vacancies, which will not be relaxed after the burn-in test.

Time to failure data obtained through in situ highly accelerated lifetime tests demonstrated that not only burn-in tests were ineffective at detecting infant mortality failures, but they also had a negative impact on reliability of BME MLCCs by creating a weak population. The electromigration of oxygen vacancies during burn-in tests shorten the lifetime of MLCC population by reducing the protection effects of double Schottky barriers at the grain boundaries and electrode interfaces.

Experimental

Commercial BME X7R MLCCs (1206 case size, 1 uF, and voltage rating (Vr) of 50 V) were used for this study to investigate the dynamics of oxygen vacancies and the associated space charge distribution during burn-in test.

Burn-in tests were carried out at 125 °C with DC fields of 2xVr for 168h and 4xVr for 21h, referred to as long and short burn-in tests in this study. For burn-in tests, these two extreme voltage conditions were chosen based on the MIL- PRF-32535A standard. After burn-in tests, the MLCCs were cooled to room temperature without maintaining the electric field.

Thermal stimulated depolarization current (TSDC) is a powerful technique for studying the relaxation kinetics of polarizable defects, and it was used to investigate the effect of the short and long burn-in tests on ionic space charge development, both intergranular (ionic charge pile up within individual grains) and transgranular (ionic transportation beyond each grain). After short and long burn-intests, TSDC was performed on screened samples; samples were then heated at a constant heating rate; and the leakage current from depolarization of the relaxing defects was measured.

Results and discussion

A burn-in test can lead to electromigration of oxygen vacancies that accumulate into metastable ionic space charge regions, and these in turn reduces the reliability of MLCCs by compromising the double Schottky barriers at the grain boundaries and electrode interfaces. TSDC measurements confirmed inter-granular and transgranular ionic space charge accumulation after burn-in tests.

Schematic of hazard rate curve of MLCCs before (solid) and after (dash) short burn-in test

These oxygen vacancies electromigration can weaken the protection effect of double Schottky barriers at the grain boundaries and electrode interfaces which eventually reduces MLCCs lifetime. The reduction in MLCCs lifetime was confirmed by comparing the mean time to failure (MTTF) and standard deviation (SD) values of samples before and after burn-in tests. Although the MTTF did not change significantly (dropped up to 18%) after burn-in tests, the SD values increased up to 130percent indicating that the TTF data are spread out, raising concerns about the consistency, predictability, and quality of BME MLCCs for applications requiring higher levels of reliability.

Conclusions

The burn-in test is a screening procedure used to eliminate weak components with a high likelihood of infant mortality and to produce uniform components for applications demanding higher levels of reliability.

We demonstrated that the costly burn-intest may be ineffective in identifying infant mortality failures, and it reduces the reliability and lifetime of BME MLCCs through intragranular and transgranular electromigration of oxygen vacancies which may not relax after the burn-in test.

These oxygen vacancies electromigration creates a weak population of BME MLCCs that may fail much sooner than expected, resulting in a subsystem or system failure.

Read more at: Yousefian, P., Randall, C.A. Determining the effect of burn-in process on reliability of X7R multilayer ceramic capacitors. J Mater Sci (2022). https://doi.org/10.1007/s10853-022-07623-9

Related

Source: Journal of Material Science

Recent Posts

Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

27.11.2025
22

TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

27.11.2025
31

Passive Components for Next Gen Automotive Systems

26.11.2025
55

Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

26.11.2025
12

Circular Connectors Coding

26.11.2025
14

YAGEO Expands Aluminum Capacitors with 80V Ratings for 48V Automotive and Industrial Systems

25.11.2025
25

Knowles Doubles Capacitance of its Class I Ceramic C0G Capacitors

24.11.2025
32

Transient Suppression Guide

19.11.2025
50

Rubycon Releases High Capacitance Radial Lead Aluminum Electrolytic Capacitors

18.11.2025
24

Upcoming Events

Dec 2
December 2 @ 12:00 - December 4 @ 14:15 CET

Microwave Packaging Technology

Dec 3
17:00 - 18:00 CET

The Hidden Secret of the Magnetic Transformer and example of its use

Dec 9
December 9 @ 12:00 - December 11 @ 14:15 EST

Space and Military Standards for Hybrids and RF Microwave Modules

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version