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    Improving SMPS Performance with Thermal Interface Material

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    Efficient Power Converters: Duty Cycle vs Conduction Losses

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    Improving SMPS Performance with Thermal Interface Material

    Polymer Tantalum Capacitors Beyond AEC-Q200 LEO Satellites

    Components Thermal and Frequency Challenges in 6G Base Stations

    Development of Nitrogen-Doped Graphene Supercapacitors 

    Layer-by-Layer Fabrication of Thin Polypropylene-based Dielectrics

    Kyocera Launches New SAW Filter for GNSS 1.6GHz Satellite Communications

    Reliability of E-Textile Conductive Paths and Passive Component Interfaces

    Flaked Tantalum Powders: High Capacitance Powders for High Reliable Tantalum Capacitors

    Efficient Power Converters: Duty Cycle vs Conduction Losses

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    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

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Energy Harvesting is not Fiction Anymore

2.3.2018
Reading Time: 2 mins read
A A
source: Würth Elektronik eiSos GmbH, EPCI e-Symposium

Abstract:

Our environment is changing and everything is becoming “electronified”. Our glasses, our hand gloves, shirts, shoes etc., can be connected already today with our smartphones and can send commands to the machinery surrounding us. We want this comfort, and we are all looking forward to having Smart Homes.

RelatedPosts

Improving SMPS Performance with Thermal Interface Material

Polymer Tantalum Capacitors Beyond AEC-Q200 LEO Satellites

Components Thermal and Frequency Challenges in 6G Base Stations

Chip manufacturers have introduced a new generation of processors to the market, which already have the built-in RF module in the chip itself. This solution is amazing, has low current requirement, and can operate with just 40 nA@3V in Sleep Mode. In case of transmission, the current is 18 mA @ +10 dBm. At this point, we can start to harvest the energy from the ambient environment for the application, and power our device. For such a solution, a power converter manufacturer developed a new chip, which is able to harvest from multiple sources. It can use a piezo or inductive harvester if we have movements/vibration; in case of temperature differences, we can harvest from a TEG (Thermo Electric Generator); or we can use the indoor solar input, and harvest the light from the ambient.

Title: Energy Harvesting is not Fiction Anymore

Author(s): Lorandt Fölkel
Organisation(s): Würth Elektronik eiSos GmbH
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: paper 5.2.  Applications Session., PCNS2017 Proceedings Pg.105-106
ISBN: 978-80-905 768-8-9
e-Sessions  Applications: Commercial
e-Sessions Scope Components: Capacitors, Inductors
e-Sessions Topics: Circuit Design


read the full paper in pdf here.

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