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    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

    TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

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    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

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Energy Harvesting is not Fiction Anymore

2.3.2018
Reading Time: 2 mins read
A A
source: Würth Elektronik eiSos GmbH, EPCI e-Symposium

Abstract:

Our environment is changing and everything is becoming “electronified”. Our glasses, our hand gloves, shirts, shoes etc., can be connected already today with our smartphones and can send commands to the machinery surrounding us. We want this comfort, and we are all looking forward to having Smart Homes.

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Chip manufacturers have introduced a new generation of processors to the market, which already have the built-in RF module in the chip itself. This solution is amazing, has low current requirement, and can operate with just 40 nA@3V in Sleep Mode. In case of transmission, the current is 18 mA @ +10 dBm. At this point, we can start to harvest the energy from the ambient environment for the application, and power our device. For such a solution, a power converter manufacturer developed a new chip, which is able to harvest from multiple sources. It can use a piezo or inductive harvester if we have movements/vibration; in case of temperature differences, we can harvest from a TEG (Thermo Electric Generator); or we can use the indoor solar input, and harvest the light from the ambient.

Title: Energy Harvesting is not Fiction Anymore

Author(s): Lorandt Fölkel
Organisation(s): Würth Elektronik eiSos GmbH
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: paper 5.2.  Applications Session., PCNS2017 Proceedings Pg.105-106
ISBN: 978-80-905 768-8-9
e-Sessions  Applications: Commercial
e-Sessions Scope Components: Capacitors, Inductors
e-Sessions Topics: Circuit Design


read the full paper in pdf here.

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