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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

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Energy Harvesting is not Fiction Anymore

2.3.2018
Reading Time: 2 mins read
A A
source: Würth Elektronik eiSos GmbH, EPCI e-Symposium

Abstract:

Our environment is changing and everything is becoming “electronified”. Our glasses, our hand gloves, shirts, shoes etc., can be connected already today with our smartphones and can send commands to the machinery surrounding us. We want this comfort, and we are all looking forward to having Smart Homes.

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Chip manufacturers have introduced a new generation of processors to the market, which already have the built-in RF module in the chip itself. This solution is amazing, has low current requirement, and can operate with just 40 nA@3V in Sleep Mode. In case of transmission, the current is 18 mA @ +10 dBm. At this point, we can start to harvest the energy from the ambient environment for the application, and power our device. For such a solution, a power converter manufacturer developed a new chip, which is able to harvest from multiple sources. It can use a piezo or inductive harvester if we have movements/vibration; in case of temperature differences, we can harvest from a TEG (Thermo Electric Generator); or we can use the indoor solar input, and harvest the light from the ambient.

Title: Energy Harvesting is not Fiction Anymore

Author(s): Lorandt Fölkel
Organisation(s): Würth Elektronik eiSos GmbH
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: paper 5.2.  Applications Session., PCNS2017 Proceedings Pg.105-106
ISBN: 978-80-905 768-8-9
e-Sessions  Applications: Commercial
e-Sessions Scope Components: Capacitors, Inductors
e-Sessions Topics: Circuit Design


read the full paper in pdf here.

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