Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Wk 45 Electronics Supply Chain Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Wk 45 Electronics Supply Chain Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Ensuring reliability of passive components for automotive designs

26.1.2019
Reading Time: 2 mins read
A A

Source: TT Electronics article

By Marcos Hsiao, Global Product Line Director, Magnetics, TT Electronics, Sensors and Specialist Components

RelatedPosts

RF Inductors: Selection and Design Challenges for High-Frequency Circuits

Wk 45 Electronics Supply Chain Digest

Transformer Safety IEC 61558 Standard

It’s hard not to feel some empathy for basic passive components. Why so? While active devices such as processors, power-management ICs, discrete power devices, and RF components get lots of designer (and media) consideration, those humble resistors, capacitors, and magnetics often get far less in comparison. They’re expected to do one thing, do it well, and do it under difficult circumstances, while “stepping aside” to let those active devices shine through.

But system reliability requires that all the many individual components work “to spec” across the entire operating spectrum of temperature, vibration, and even contaminants. For this reason, engineering and fabricating a reliable passive device which meets the arduous and stringent automotive-segment mandates is more involved than just paying modest attention to electrical and mechanical details, although those are very necessary steps.

For designers, there’s much more to selecting an automotive passive component than checking that it is “qualified.” It’s also a matter of asking “qualified for what?” There is no single minimum auto standard; instead, the industry has defined levels of ruggedness for the various settings within the vehicle. After all, the underhood stress situation is far different than the in-cabin environment.

Qualification for automotive passives begins with the industry’s AEC-Q200 standard (note that the associated Q100 standard deals with ICs, while Q101 is for discrete semiconductors). There are five overall grades, with four them spanning vehicle use from the relatively benign passenger compartment to the more hostile underhood environment.

 

[AEC – the Automotive Electronics Council – is an industry organisation that promotes the standardisation of reliability or qualification standards for automotive electronic components; members include major automotive manufacturers and major electronic component manufacturers.]

Although operating temperature range is a critical ruggedness parameter called out by AEC-Q200, it is not the only one. Among the many others defined are temperature cycling, thermal stress, dimensional stability, terminal strength, solvent resistance, shock and vibration, solderability, flammability, and ESD – all requirements that need to be attained while still meeting the basic electrical-performance specifications. In short, it’s not easy to get that “sticker” which proclaims “qualified to AEC-Q200, Grade level x.”

As a result, designers have two issues to manage.

First, they must be careful not to “overspecify” the passives on their BOM (Bill of Materials) – there’s a monetary and even sourcing availability cost involved with spec’ing Grade 1 (underhood) when Grade 3 will do. There’s also the opposite concern of making sure that the supply chain (purchasing, inventory, production) does not substitute a lower-performance grade for the one specified, whether due to human error, availability, or a misguided attempt to save some money.

When that sort of passive-component downgrade happens, there are multiple possible consequences, all unpleasant: unexpected field failures, finger-pointing (many times misguided and premature) often starting with the design team as to what went wrong and whose fault it was, the need for various forensic teams to do serious, time-intensive “detective” work, with report writing, and an action plan; perhaps even recalls and lawsuits (yes, these things happen…).

So the lesson is clear: be diligent in understanding the various levels and specifics of passive-components and their qualification, choose the right one, work closely with your vendors, and be sure it is actually used where and how it is intended by the design and qualification teams.

Related

Recent Posts

RF Inductors: Selection and Design Challenges for High-Frequency Circuits

10.11.2025
24

Transformer Safety IEC 61558 Standard

7.11.2025
8

ESR of Capacitors, Measurements and Applications

7.11.2025
40

3-Phase EMI Filter Design, Simulation, Calculation and Test

6.11.2025
48

Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

6.11.2025
12

Capacitor Lead Times: October 2025

6.11.2025
66

Paumanok Unveils Aluminum Capacitor Foils World Markets Study 2025-2030

6.11.2025
14

Coilcraft Introduces Ultra-Low Loss Shielded Power Inductors

6.11.2025
15

Exxelia Presents Smart Integrated Magnetics Solution at Space Tech Expo 2025 

5.11.2025
16

Upcoming Events

Nov 11
17:00 - 18:00 CET

Industrial Applications Demand More from Interconnects in Next-Gen Designs

Nov 12
11:00 - 12:00 CET

PCB Design: Impedance is for everyone!

Nov 12
November 12 @ 12:00 - November 13 @ 14:15 EST

Microelectronic Packaging Failure Modes and Analysis

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version