Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Ripple Steering in Coupled Inductors: SEPIC Case

    TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

    Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Vishay Releases High Current 3.3 V to 36 V ESD Protection Diodes

    TDK Extends SMT Gate Drive Transformers to 1000 V

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Ripple Steering in Coupled Inductors: SEPIC Case

    TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

    Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Vishay Releases High Current 3.3 V to 36 V ESD Protection Diodes

    TDK Extends SMT Gate Drive Transformers to 1000 V

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Ensuring reliability of passive components for automotive designs

26.1.2019
Reading Time: 2 mins read
A A

Source: TT Electronics article

By Marcos Hsiao, Global Product Line Director, Magnetics, TT Electronics, Sensors and Specialist Components

RelatedPosts

DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

Ripple Steering in Coupled Inductors: SEPIC Case

TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

It’s hard not to feel some empathy for basic passive components. Why so? While active devices such as processors, power-management ICs, discrete power devices, and RF components get lots of designer (and media) consideration, those humble resistors, capacitors, and magnetics often get far less in comparison. They’re expected to do one thing, do it well, and do it under difficult circumstances, while “stepping aside” to let those active devices shine through.

But system reliability requires that all the many individual components work “to spec” across the entire operating spectrum of temperature, vibration, and even contaminants. For this reason, engineering and fabricating a reliable passive device which meets the arduous and stringent automotive-segment mandates is more involved than just paying modest attention to electrical and mechanical details, although those are very necessary steps.

For designers, there’s much more to selecting an automotive passive component than checking that it is “qualified.” It’s also a matter of asking “qualified for what?” There is no single minimum auto standard; instead, the industry has defined levels of ruggedness for the various settings within the vehicle. After all, the underhood stress situation is far different than the in-cabin environment.

Qualification for automotive passives begins with the industry’s AEC-Q200 standard (note that the associated Q100 standard deals with ICs, while Q101 is for discrete semiconductors). There are five overall grades, with four them spanning vehicle use from the relatively benign passenger compartment to the more hostile underhood environment.

 

[AEC – the Automotive Electronics Council – is an industry organisation that promotes the standardisation of reliability or qualification standards for automotive electronic components; members include major automotive manufacturers and major electronic component manufacturers.]

Although operating temperature range is a critical ruggedness parameter called out by AEC-Q200, it is not the only one. Among the many others defined are temperature cycling, thermal stress, dimensional stability, terminal strength, solvent resistance, shock and vibration, solderability, flammability, and ESD – all requirements that need to be attained while still meeting the basic electrical-performance specifications. In short, it’s not easy to get that “sticker” which proclaims “qualified to AEC-Q200, Grade level x.”

As a result, designers have two issues to manage.

First, they must be careful not to “overspecify” the passives on their BOM (Bill of Materials) – there’s a monetary and even sourcing availability cost involved with spec’ing Grade 1 (underhood) when Grade 3 will do. There’s also the opposite concern of making sure that the supply chain (purchasing, inventory, production) does not substitute a lower-performance grade for the one specified, whether due to human error, availability, or a misguided attempt to save some money.

When that sort of passive-component downgrade happens, there are multiple possible consequences, all unpleasant: unexpected field failures, finger-pointing (many times misguided and premature) often starting with the design team as to what went wrong and whose fault it was, the need for various forensic teams to do serious, time-intensive “detective” work, with report writing, and an action plan; perhaps even recalls and lawsuits (yes, these things happen…).

So the lesson is clear: be diligent in understanding the various levels and specifics of passive-components and their qualification, choose the right one, work closely with your vendors, and be sure it is actually used where and how it is intended by the design and qualification teams.

Related

Recent Posts

Ripple Steering in Coupled Inductors: SEPIC Case

27.8.2025
1

TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

27.8.2025
3

Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

27.8.2025
5

SEPIC Converter with Coupled and Uncoupled Inductors

26.8.2025
8

Coupled Inductors in SEPIC versus Flyback Converters

26.8.2025
6

Vishay Releases High Current 3.3 V to 36 V ESD Protection Diodes

25.8.2025
11

TDK Extends SMT Gate Drive Transformers to 1000 V

20.8.2025
20

Non-Linear MLCC Class II Capacitor Measurements Challenges

19.8.2025
39

Researchers Demonstrated HfO Anti-Ferroelectric Flexible Capacitors

19.8.2025
19

Stackpole Unveils Metal Element High Current Chip Jumpers

19.8.2025
37

Upcoming Events

Aug 27
17:00 - 18:00 CEST

Capacitor Assemblies for High-Power Circuit Designs

Sep 3
15:30 - 17:30 CEST

How to Choose Your Magnetic Supplier

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version