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    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

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    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

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    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

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    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

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Infineon integrates shunt resistors into EconoDUAL3 modules

27.2.2018
Reading Time: 1 min read
A A

source: Electronics weekly news

Infineon has integrated shunt resistors into its EconoDUAL3 modules  for current monitoring in the AC path.

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Implementing these devices helps inverter manufacturers to reduce cost, improve performance and simplify the inverter designs.

The EconoDUAL 3 with integrated shunts can be used in a wide variety of applications, such as general purpose motor drives, uninterruptable power supplies, and solar. It is also a perfect fit for agricultural and commercial vehicles as well as for busses.

New inverter generations aim at cost reduction and increased power density at high lifetime levels. So far, constant improvements in this regard were restricted to the electrical performance of IGBTs, diodes, and the interconnection technologies.

Integrating functionality into the IGBT module, the EconoDUAL 3 enables further cost reduction. With its integrated shunts, external current sensors are no longer needed.

This saves space in the system, reduces material costs and manufacturing efforts.

In addition, the integration results in high current measurement accuracy across a wide temperature range leading to a very precise motor control.

The new EconoDUAL 3 shunt module family supports current ranges from 300 A to 600 A at 1200 V. It features the proven IGBT4 with Infineon’s trench/fieldstop technology.

The modules are available with pre-applied Thermal Interface Material (TIM) for lowest thermal resistance and longest lifetime.

In addition, the housing with PressFIT pins enables a fast and cost efficient assembly.

The 450 and 600 A EconoDUAL 3 modules are already available. An additional variant with 300 A is planned to be released in March 2018. All three current classes are supported with an evaluation board which will be launched around mid of 2018.

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