Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Vishay Sfernice D2TO and DTO thick-film SMD power resistor sample kits with TO-263 D2PAK and TO-252 DPAK devices

    Vishay SMD Power Resistor Sample Kits for High-Power Design

    schurter-tcsv4-side-actuated-smt-tactile-switch

    SCHURTER Introduces Side-Actuated SMT Tactile Switch

    TLVR multiphase coupled inductors, auxiliary ballast inductor

    TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

    Bourns CRH2512 2512 surface-mount metal-alloy current-sense resistor for high-current low-ohmic measurement

    Bourns CRH2512 5 W Current-Sense Resistors

    Littelfuse AK-FL FlatSuppressX axial-leaded bidirectional TVS diodes for high-voltage aviation DC power protection

    Littelfuse AK-FL TVS Diodes for Aviation DC Power Rails

    Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

    Rheinmetall Funds NanoLam Capacitor Production Scale-Up

    Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

    Bourns Extends 1216 Kelvin Current Sense Resistors

    Modelithics COMPLETE+3D Library v26.3 for Ansys HFSS with RF passive component and 3D electromagnetic simulation models

    Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Vishay Sfernice D2TO and DTO thick-film SMD power resistor sample kits with TO-263 D2PAK and TO-252 DPAK devices

    Vishay SMD Power Resistor Sample Kits for High-Power Design

    schurter-tcsv4-side-actuated-smt-tactile-switch

    SCHURTER Introduces Side-Actuated SMT Tactile Switch

    TLVR multiphase coupled inductors, auxiliary ballast inductor

    TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

    Bourns CRH2512 2512 surface-mount metal-alloy current-sense resistor for high-current low-ohmic measurement

    Bourns CRH2512 5 W Current-Sense Resistors

    Littelfuse AK-FL FlatSuppressX axial-leaded bidirectional TVS diodes for high-voltage aviation DC power protection

    Littelfuse AK-FL TVS Diodes for Aviation DC Power Rails

    Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

    Rheinmetall Funds NanoLam Capacitor Production Scale-Up

    Bourns CSS4C-1216 four-terminal metal-strip current sense resistor for high-current Kelvin measurement

    Bourns Extends 1216 Kelvin Current Sense Resistors

    Modelithics COMPLETE+3D Library v26.3 for Ansys HFSS with RF passive component and 3D electromagnetic simulation models

    Modelithics COMPLETE+3D v26.3 Expands HFSS RF Models

    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

June 2024 Component Distribution Supply Chain

18.6.2024
Reading Time: 3 mins read
A A

Component Distribution Supply Chain Component Insights – June 2024 by Edgewater Research shows Mixed Update with Continued Unevenness Especially in Semis.

What’s Changed/What’s New?
1. C2Q POS seen as mixed QTD with pockets of stability (IP&E and Asia) and areas of incremental softness (semis in the West).
2. Semi orders seen as sporadic/uneven in April/May, in some cases reversing after an uptick in March. Semi B2B tracking up Q/Q on lower POS but still at 0.9x range with Asia closer to 1. IP&E orders seen stable with continued green shoots and B2B at or above 1.
3. Lack of sustainable order improvement seen eroding 2H recovery optimism; forecasts projecting flat to modest POS uptick 2H/1H.
4. C3Q POS projected flat to up LSD in Asia on muted Industrial/Auto, down mid-single digit in Europe and flattish in Americas.
5. Analog Devices seen moving Arrow to fulfillment-only starting in May at <5% GM. Analog Devices viewed also taking accounts direct as part of the change.

RelatedPosts

Wk 36 Electronics Supply Chain Digest

Wk 35 Electronics Supply Chain Digest

Wk 34 Electronics Supply Chain Digest

Top 5 Channel Comments:
• April and May POS were both slower than expected. This is not that surprising as we had to aggressively push product globally at the end of 1Q to meet targets. Meanwhile, end demand is lukewarm at best, so we just pulled forward shipments.
• It is hard to call a bottom in disti POS in the West. It felt like that back in March and early April but since then it has softened again in May and into early June. At best it feels like bouncing around the bottom.
• It is surprising that Arrow took a sub 4% gross margin deal with Analog Devices as there is no coming back from that. Near term it makes sense to offset headcount reduction but longer term it wouldn’t work. TI did the same several years ago before moving more direct.
• Lattice just fired Future Electronics with the plan to consolidate its distribution business with Arrow. It appears that Arrow offered 4-5 points of margin below Future and Lattice took it.
• Inventory in China is about 3 months which is in-line with targets. However, 50% of it is aging inventory at high price and that is a major problem. We are discussing internally whether to write it off. This is a last resort for us. We are still trying to work with customers and suppliers to find a solution.

Other Key Takeaways:
6. Analog Devices’ shift to fulfillment-only seen resembling TI’s 2016 strategy change, which preceded TI’s shift to direct sales.
7. TI displeased by Arrow selling TI SKUs above policy margin, considering engaging other distis or accelerating the shift direct.
8. Distributors seeing increased opportunities for share gains from Future in recent months. Arrow noted consolidating Lattice programs from Future; private distributors seeing opportunities to gain business based on terms.
9. Inventory seen directionally improving in 2Q led by IP&E while challenges remain in semis. Aging high priced semi inventory noted as a growing concern with suppliers offering mixed support. Private distis seen writing off some inventory, Arrow/Avnet not yet.
10. Aging inventory and prolonged weakness seen driving incremental competitive pressure with distis noted flexing price in order to move product and gain share. Competitive dynamics still viewed as normal for this stage of the cycle.

Conclusion:
Component distribution fundamentals are mixed in May and early June, characterized by uneven demand, sporadic bookings, and semi B2B still below 1. While there is some progress, we remain cautious, anticipating a muted recovery in 2H demand due to inventory levels remaining a headwind and limited signs of improvement in end demand. Considering these dynamics, prospects for a real recovery in demand appear to be pushing out again, with significant improvement in 1H25 starting to seem more likely.

Full report available from: Dennis Reed, Sr. Research Analyst, Edgewater Research

Related

Source: Edgewater Research

Recent Posts

Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

Rheinmetall Funds NanoLam Capacitor Production Scale-Up

22.9.2026
44

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
93
ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

10.9.2026
49

Emerging Capacitor Markets in Fusion Energy

10.9.2026
68
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
156

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
66

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
81

Connector Industry Performance Accelerates Through Mid-2026

31.8.2026
60

Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

20.8.2026
133

Upcoming Events

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Sep 30
15:00 - 16:00 CEST

Positronic Space and Military Connectors

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0
  • Ohm’s Law Answers Your Questions

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved