Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Top 10 Connector Vendors by Product Type

    Bourns Releases High‑Q Air Coil Inductors for RF Aplications

    CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

    ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

    Würth Elektronik Offers Halogen‑Free EMC Gaskets for Displays and Housings

    Component Distribution Supply Chain January 2026

    Binder Unveils M8 Flange Solder Connectors for Flexible Cabling

    Power Electronics Tools for Passives and Magnetic Designs

    Modelithics Releases Component Model Library for SIMULIA CST Studio Suite

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Top 10 Connector Vendors by Product Type

    Bourns Releases High‑Q Air Coil Inductors for RF Aplications

    CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

    ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

    Würth Elektronik Offers Halogen‑Free EMC Gaskets for Displays and Housings

    Component Distribution Supply Chain January 2026

    Binder Unveils M8 Flange Solder Connectors for Flexible Cabling

    Power Electronics Tools for Passives and Magnetic Designs

    Modelithics Releases Component Model Library for SIMULIA CST Studio Suite

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Kemet Introducing New O Case Size for Tantalum Polymer Stacks

1.7.2020
Reading Time: 6 mins read
A A

Kemet electronics is introducing new O case size in TSM Series (T541 and T543) for tantalum polymer stacks. The new released extension is offering improved volumetric efficiency mainly for the defense and aerospace market.

Tantalum polymer capacitors are expanding their market share in the defense and aerospace market because they offer superior electrical performance (primarily much lower ESR), have outstanding reliability, and display a more benign failure response than the incumbent MnO2-cathode tantalum capacitor technology.

RelatedPosts

NIC Components Extends SMD High Voltage MLCC Offering

Stackpole Offers RoHS Compliant Lead-Free Thick Film Chip Resistors

Smiths Interconnect’s SMD Power Resistors with Heat Sink Qualified to Space Flights

It is normal that engineers want to use this new technology in high reliability applications. It is expected that during the next four (4) years the adoption of this technology will increase by 22% (compared with 2019 data).

Figure 1 – Market forecast for Polymer technology (www.statista.com)

Polymer technology can offer significant advantages and savings over traditional tantalum capacitors and other solutions as MLCC’s or Electrolytic components. They have lower voltage de-rating, provide good volumetric efficiency, which is complemented with ultra-low ESR and ESL, so ripple current ratings are significantly improved. The capacitance range at discrete level can go up to 1,500 µF and rated voltages from 2.5 to 63 VDC. The ESR can be as low as 5 mOhms and ripple current ratings can be 4 to 5 times higher than traditional MnO2 tantalums.

Ta polymer capacitors are solid state capacitors that demonstrate no wear out mechanisms when operated within their recommended guidelines. While they can be operated at full rated voltage, most circuit designers seek a minimum level of assurance in long term reliability, which should be demonstrated with data.

A voltage derating can provide the desired level of demonstrated reliability based on industry accepted acceleration models. Capacitance is not impacted by bias and it is a suitable technology for high reliability applications that follow the actual trend of higher switching frequencies with better performance in terms of capacitance roll off.

Figure 2 – ESR and Capacitance behavior in frequency (Polymer Vs MnO2)

Defense and aerospace application requirements are changing fast. In space segment, ultra-low ESR is the main drivers and defense designers are searching for solutions that can combine the lowest ESR (single digit level) with the highest capacitance possible for power rails from 28 V up to 50 V. the derating capability offered by polymer technology becomes the preferred solution in this scenario. In Fig. 3, the differences between the standard Tantalum (MnO2) with a derating of 50% are compared with the new landscape of power lines for tantalum polymer technology, requiring only 10% to 20% voltage derating.

Figure 3 – Derating capability: Polymer Vs MnO2

Hi-Rel polymer series, are the first polymer electrolytic capacitors available with failure rate options as defined by KEMET’s KO-CAP Reliability Assessment method. This method utilizes accelerated conditions (voltage and temperature) applied to board-mounted samples to assess long term device reliability. The failure rates available are B (0.1% per 1,000 hours), C (0.01% per 1,000 hours), and D (0.001% per 1,000 hours). The KO-CAP Reliability Assessment method was developed as a result of over 10 years of research to find a solution for reliability grading of polymers since Weibull grading as per MIL-PRF-55365 is often ineffective when applied to this technology. Because this well-established tool often proves ineffective, the new reliability assessment strategy was needed to be developed by KEMET (applicable to T540 and T541 Series) and for the new MIL-PRF-POLY T580 and T581 Series.

With significant success in Defense and Aerospace market, typical applications for polymer tantalum capacitors include, decoupling, hold-up, and filtering. In addition, the T540/T541 and T543 Polymer HRA stack devices can be utilized in defense and aerospace equipment’s, including, High Power Amplifiers for radars and multiple applications where GaN active components are a part of the design.

Figure 4 – KEMET Polymer series (HRA and MIL-PRF) Vs market segments

High capacitance is a requirement for these applications and KEMET’s TSP (Tantalum Stack Polymer) becomes a viable solution when there are space limitations on the PCB but adequate headroom to accommodate the height of the TSP Series. This is driven by the need to build large charge storage banks.

KEMET has available multiple configurations for stacking, different case sizes and applicable to most of existing series available (including MnO2 – TSM Series).

With the introduction of the new O case size in TSM Series (T541 and T543) and TSP series, improved volumetric efficiency became available to the defense and aerospace market. The O case, is an EIA (7360-43) with the following mechanical specifications:

This new case size extends the offer of capacitance to each rated voltage level and in parallel with the ESR reduction of these new part numbers. Below, the extension of T541 values, is presented (from X case to O case).

The TSP series has two available configurations using the discrete O case size:

TSP2 – Two (2) discrete capacitors

Example of a high runner (2O) part number:

TSP4 – Four (4) discrete capacitors

Example of a high runner (4O) part number:

Conclusion

KEMET’s TSP (Tantalum Stack Polymer) capacitors are the most efficient solution when engineers need to design a high energy source for signal power amplification. With the highest volumetric efficiency available and the unique ultra-low ESR performance in a high reliability application, this product is an ideal solution for the described use scenario. Rated voltage levels are aligned with the today’s requirements for Vdd bias (typical levels of 28V up to 60V) offering high capacitance stability in a wide range of voltage and temperature.

Related

Source: Kemet

Recent Posts

CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

28.1.2026
18

ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

28.1.2026
17

Samsung Q4 2025 Results: MLCC focus for AI, Server and Automotive

26.1.2026
50

Capacitor Technology Dossier

26.1.2026
70

Passive Components in Quantum Computing

22.1.2026
122

Miniaturization of MLCCs and Electrolytics, KAVX Tech Chat

21.1.2026
67

Exxelia Offers Custom Naval Transformers and Inductors

21.1.2026
16

Researchers Demonstrated 32nm Aluminum Vacuum Gap Capacitor

20.1.2026
39

Conductive Polymer Capacitor Market and Design‑In Guide to 2035

20.1.2026
139

Upcoming Events

Feb 24
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • How Metal Prices Are Driving Passive Component Price Hikes

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Degradation of Capacitors and its Failure Mechanisms

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version