Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

23.2.2026
Reading Time: 6 mins read
A A

This article by Dr. V. Azbel, an Independent consultant on tantalum capacitors investigates influence of the size of sintered tantalum pellets on stability during the tantalum oxide film formation.

This study examines the impact of geometric dimensions on the mechanical properties and stability of sintered porous tantalum pellets during oxide film formation.

RelatedPosts

From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

All technological parameters, including powder grade, pressing density, sintering temperature and time, shrinkage, and oxygen content, were kept constant, with the sole variable being pellet size. The findings indicate that yield strength and heat dissipation, both influenced by neck size, are critical factors in determining stability during formation.

Introduction

Sintered porous tantalum pellets, produced from 20 kCV/g powder with a green density of 5.5 g/cm³ and sintered at 1620°C for 20 minutes, are utilized in the manufacturing of tantalum capacitor anodes. Given identical sintering conditions, shrinkage was uniform across samples.

The morphology of the porous structure significantly affects the pellets’ behavior during oxide film formation. Stress-strain curve characteristics were employed as numerical indicators. Previous research has shown that yield strength, Young’s modulus (k₁), and the hardening coefficient (k₂) are contingent upon pressing and sintering conditions. In this study, all parameters and pellet shapes were consistent, allowing for an exploration of the effects of pellet size on thermal conductivity, internal stresses, and stability during formation.

Experimental

In an experimental study, tantalum powder of uniform grade, with a specific gravity of 20 kCV/g, was used to create pellets under identical processing conditions, including temperature, time, density, shrinkage, and oxygen content.

The pellets were categorized into two sizes: Pellet A, which had a smaller diameter and height, and Pellet B, which was larger in dimensions. After sintering, both pellets were subjected to electrolytic formation at the same voltages using two different electrolytes: 0.01% H₃PO₄ and a mixture of 50% glycol with 0.05% H₃PO₄. These electrolytes differ in conductivity, which affects the electrolysis rate and heat dissipation, with the formation current normalized to mass in amperes per gram.

Processing Conditions: Pellets A and B were processed under identical conditions (temperature, time, density, shrinkage, oxygen content).

Samples: 

  • Pellet A: Smaller diameter and height.
  • Pellet B: Larger dimensions.
Pellet SizePellet APellet B
diameter [mm]3.14.83
height [mm]110

Post-sintering, the pellets underwent electrolytic formation at identical voltages in two electrolytes:

  • 0.01% H₃PO₄
  • 50% glycol + 0.05% H₃PO₄

These electrolytes vary in conductivity, influencing the electrolysis rate and heat dissipation. The formation current was normalized to mass (A/g).

Results

The results, as depicted in Figure 1, include combined data on mechanical parameters, stress-strain diagrams, and stress distribution under compression for both pellets.

Pellet A demonstrated a yield strength approximately 40% higher than Pellet B, suggesting a larger cross-section of necks in its porous structure and superior heat dissipation. The variation in pellet size led to different stress distributions and density distributions, influencing neck size.

During the formation process, in the 0.01% H₃PO₄ electrolyte, Pellet A maintained its integrity, while Pellet B was destroyed. However, in the low-conductivity electrolyte consisting of 50% glycol and 0.05% H₃PO₄, both pellets underwent formation without destruction. The reduced conductivity in this electrolyte slowed down film growth and heat release, ensuring stability even for pellets with lower yield strength.

Behavior of pellets A and B during formation in 0.01% H₃PO₄ electrolyte (left) and  in low-conductivity electrolyte 50% glycol + 0.05% H₃PO₄

In summary – behavior during formation:

  • In 0.01% H₃PO₄ Electrolyte: 
    • Pellet A maintains integrity.
    • Pellet B is destroyed.
  • In Low-Conductivity Electrolyte (50% glycol + 0.05% H₃PO₄): 
    • Both pellets undergo formation without destruction.
    • Reduced conductivity slows film growth and heat release, ensuring stability even for pellets with lower yield strength.

Discussion

The discussion highlights several key points:

1. Heat Dissipation and Yield Strength Yield strength is correlated with the cross-sectional size of necks in the porous structure. Higher yield strength, at similar k₂ values, enhances heat dissipation.

2. Role of Pellet Size: Differences in pellet dimensions lead to varied stress distributions and heat dissipation capabilities.

3. Electrolyte and Film Growth Rate**: Lower electrolyte conductivity reduces oxide film growth rate, heat generation, and enhances pellet stability during formation.

4. Indirect Estimation of Stress Distribution: Stress distributions are not directly observable but can be inferred from stress-strain curves.

Conclusion

In conclusion, under identical technological parameters, the behavior of sintered tantalum pellets during formation is solely influenced by their size. Pressing and sintered density are not reliable indicators of the porous structure. Yield strength, correlating with neck size and heat dissipation, is the key factor in stability. For pellets with lower yield strength, reducing the oxide film growth rate using electrolytes of lower conductivity decreases heat generation and prevents destruction.

Appendix

Strain-Stress Curve Parameters for Porous Materials

Yield Stress (Ay): The yield stress of porous materials is related to the ratio of neck size (X) to primary powder particle size (D) by the equation:

Ay = b*A0*(X/D)², where b is an empirical constant, Ay is the yield point of the sintered porous material, and A0 is the yield point of the deformed material.

Young’s Modulus (k1 ~ E): Described by the equation: k1 ~ E = E0 (1-p/pc), where E is the elastic modulus of a porous material, E0 is the modulus of solid material at density pc ~ 1, and p is the porosity-related density.

Hardening Coefficient (k2 ~ P): An exponential coefficient correlating with material defectiveness.

Note: The size D determines BET.

References

Vladimir Azbel: Structural Interpretation of Reliability in Tantalum Capacitor Anodes

Related

Source: Azbel

Recent Posts

Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
6
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
15
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
35
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
25
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
26
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
36
TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

TDK Expanded DC-Link Film Capacitors to Reach +135 °C

2.10.2026
45
Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

Electrification Raises Demands on DC-Link Capacitors

1.10.2026
35
YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

1.10.2026
46

Upcoming Events

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved