Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Image credit: Samtec

    How to Match the Right Connector with Protocol Requirements

    Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Image credit: Samtec

    How to Match the Right Connector with Protocol Requirements

    Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

KYOCERA to Build New MLCC Manufacturing Plant in Japan

17.8.2022
Reading Time: 1 min read
A A

KYOCERA announced its plans to build new MLCC manufacturing plant in Japan to meet raising demand from 5G, ADAS and EV applications.

Expanded MLCC multilayer ceramic capacitor production at Kagoshima Kokubu Campus in Japan will help meet strong market demand, increased production slated to begin in 2024.

RelatedPosts

KYOCERA Releases SAW Devices with Significantly Lower Loss

KYOCERA Releases Industry Smallest SAW Quadplexer

KYOCERA Developed Industry Leading 008004 Hi-Q MLCC for PA Modules

Kyocera Corporation announced that it will construct a new production facility at its Kokubu Plant Campus in Kagoshima, Japan, to increase its production capacity of multilayer ceramic capacitors (MLCCs), strengthen engineering development capabilities, and ensure ample manufacturing space as Kyocera’s business expands.

Demand for MLCCs is expected to grow as communication terminals and semiconductor devices become more compact and sophisticated. Additionally, the expanding commercialization of 5G data centers, ADAS (advanced driver assistance systems) and EV (electric vehicle) technology will be facilitated by smaller, more functional electronic components like MLCCs.

A signing ceremony held on August 17, 2022 included Kagoshima Governor Koichi Shiota, Kirishima City Mayor Shinichi Nakashige, and Kyocera officials. Construction will begin in February 2023 and the plant will begin operation in May 2024. The new plant will be located on the current site of Kyocera’s Monozukuri R&D Laboratory, which will be demolished in September, 2022.

In addition to enhancing its electronic components business, Kyocera aims to stimulate economic development in Kagoshima Prefecture and to create new employment opportunities in the community.

Related

Source: KYOCERA

Recent Posts

ESR of Capacitors, Measurements and Applications

7.11.2025
17

Murata Christophe Pottier Appointed President of EPCIA

7.11.2025
6

3-Phase EMI Filter Design, Simulation, Calculation and Test

6.11.2025
25

Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

6.11.2025
9

Capacitor Lead Times: October 2025

6.11.2025
53

Paumanok Unveils Aluminum Capacitor Foils World Markets Study 2025-2030

6.11.2025
13

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

3.11.2025
24

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

3.11.2025
32

Lightweight Model for MLCC Appearance Defect Detection

3.11.2025
25

DMASS Reports First Positive Signs of European Distribution Market in Q3/25

3.11.2025
13

Upcoming Events

Nov 11
17:00 - 18:00 CET

Industrial Applications Demand More from Interconnects in Next-Gen Designs

Nov 12
11:00 - 12:00 CET

PCB Design: Impedance is for everyone!

Nov 12
November 12 @ 12:00 - November 13 @ 14:15 EST

Microelectronic Packaging Failure Modes and Analysis

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version