Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Modelithics Partners with ANSYS to Accelerate Creation of Complex Wireless Communication Systems for 5G and the IIoT/Industry 4.0

19.12.2018
Reading Time: 2 mins read
A A

Source: Modelithics news

PITTSBURGH, December 18, 2018 –Modelithics and ANSYS will develop the industry’s first 3D electromagnetic simulation component model library that will enable customers to accelerate the design of wireless communication systems for 5G, smart devices and the industrial internet of things (IIoT/Industry 4.0). The partnership creates a new industry paradigm for sharing intellectual property (IP) and increases the accuracy of the radio frequency (RF) and microwave design process for networking equipment and mobile devices.

RelatedPosts

Samsung Releases Automotive Molded 2220 1kV C0G MLCC

How to Select Ferrite Bead for Filtering in Buck Boost Converter

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

Components such as inductors, capacitors, connectors and packaged filters used in wireless communication devices are packed tightly together in compressed packages to achieve increased functionality and product miniaturization. The resulting component-to-component electromagnetic (EM) field interactions and coupling, which are typically ignored in a system-level modeling approach, can significantly influence circuit performance, especially at higher 5G and millimeter wave frequencies. The ability to predict these effects during simulation is critical to meeting development timelines within budget.

Modelithics and ANSYS will create a library of models that are defined by their physical geometry and material properties and can properly simulate interactions between components and their surrounding environment. These simulation-ready 3D components can simply be added to larger system designs in ANSYS® HFSSTM without the need to apply excitations, boundary conditions or material properties.

“Through the partnership, developers of discrete components can create simulation-ready 3D components in ANSYS HFSS and provide them to end users who can reference them in larger system simulation,” said Larry Dunleavey, president, Modelithics. “The ability to collaborate through 3D

components enables vendors to provide their customers with HFSS simulation-ready models, giving them a valuable edge in enabling first-pass design success.”

“The sharing of 3D simulation-ready components is a new paradigm in electronics design and is made possible through the use of high-level, standard encryption algorithms and ANSYS’ patented feature to hide model details in HFSS — keeping a vendor’s IP safe,” said Mark Ravenstahl, technical director, strategic partnerships and business development at ANSYS.

“As the leader in providing RF and microwave models, Modelithics is the right partner to deliver these models. Multiple component vendors have already committed to participating in the initiative to prioritize 3D model development of their parts.”

Related

Recent Posts

Samsung Releases Automotive Molded 2220 1kV C0G MLCC

23.10.2025
11

How to Select Ferrite Bead for Filtering in Buck Boost Converter

23.10.2025
22

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

23.10.2025
27

Power Inductors Future: Minimal Losses and Compact Designs

22.10.2025
28

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

22.10.2025
7

Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

21.10.2025
28

Murata Integrates Component Models into Cadence EDA Tools

21.10.2025
37

Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

20.10.2025
12

Bourns Release Automotive 4-Terminal Shunt Resistors

17.10.2025
21

Bourns Releases High Inductance Common Mode Choke

16.10.2025
21

Upcoming Events

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

Oct 30
11:00 - 12:00 CET

Space Ceramic Capacitors with Flexible Testing

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version