Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Murata introduces Chip inductor for NFC circuits

25.1.2017
Reading Time: 2 mins read
A A

source: Murata news

Murata Manufacturing Co., Ltd. has started production of the LQM18JN Series of chip inductors for near field communication (NFC*1) in January.

RelatedPosts

How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

In recent years, an increasing number of electronic devices such as smartphones have included NFC capability. An NFC circuit utilizes a chip inductor for impedance matching*2, however, current with large amplitude flows in an NFC matching circuit. With a common matching inductor, the effect of magnetic saturation*3 hinders the expected performance. The LQM18JN Series has been designed specifically for NFC matching circuits and is not easily impacted by magnetic saturation. In addition, its closed magnetic circuit configuration suppresses interference with surrounding components even at high mounting density, making it ideal for reducing the size of the NFC circuit.

Rating

Part Number Inductance
Q
(or higher)
Self-Resonance
Frequency
(MHz or higher)
Rated Current
(mA)
Nominal Value
(nH)
Tolerance
(%)
LQM18JNR10J00 100 ±5% 8 200 650
LQM18JNR12J00 120 ±5% 8 150 610
LQM18JNR16J00 160 ±5% 8 100 550

Features

  • Small size at L:1.6×W:0.8×T:0.55mm (Typ.)
  • With ±5% narrow deviation, ideal for matching.

Applications

  • NFC modules mounted in devices such as smartphones.

Part number

LQM18JNxxxx00 (Enter alphanumeric characters at the “x” locations to indicate the inductance and inductance deviation.)
For details see the product page for LQM18JN.

External size

 

Explanation of Terms
*1. NFC: An acronym for Near Field Communication, in a broader sense it encompasses various standards, but generally it indicates use of the 13.56MHz band at which communication is enabled by touching another NFC compliant device.
*2. Impedance matching: In wireless communication circuits, when components of differing specific impedance for a route in which a signal flows are connected, a reflection of the signal occurs, and this lowers the power of the signal being transferred, and it is therefore linked to a decrease in the sensitivity of the wireless circuit. To counter this, an impedance matching circuit is inserted between components of differing specific impedance so that reflection does not occur, and the related operation is called impedance matching.
*3. Magnetic saturation: When a large current flows with an inductor having a strong magnetic body such as ferrite, a phenomenon is generated wherein the inductance drops. This is called magnetic saturation of the inductor. When magnetic saturation of the inductor is generated in a matching circuit, the inductance falls and therefore the inductance required for matching cannot be maintained, and this lowers the precision of the matching.

Related

Recent Posts

Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

5.11.2026
14
YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

5.11.2026
8

Transformer Losses and Thermal Design: Modelling and Validation

4.11.2026
20
Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

4.11.2026
20
Schematic diagrams illustrating the physical model of the stripline microinductor.

Stripline Microinductors with Nickel–Iron Oxide Cores

4.11.2026
9
Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

3.11.2026
34
Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

Exxelia Brings High-Temperature Passives to Electronica 2026

29.10.2026
44
illustration of packaged SMD power inductors on a four-wire cryogenic characterization board

Cryogenic SMD Inductors at 4 K: Low DCR, Persistent AC Loss

26.10.2026
17
Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

Bourns Releases BMS Transformer with 3.5 mm Height

21.10.2026
21

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved