Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

    YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

    Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

    YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

    Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Murata introduces Chip inductor for NFC circuits

25.1.2017
Reading Time: 2 mins read
A A

source: Murata news

Murata Manufacturing Co., Ltd. has started production of the LQM18JN Series of chip inductors for near field communication (NFC*1) in January.

RelatedPosts

YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

Würth Elektronik Expanded Capacity for Validation and Services in Asia

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

In recent years, an increasing number of electronic devices such as smartphones have included NFC capability. An NFC circuit utilizes a chip inductor for impedance matching*2, however, current with large amplitude flows in an NFC matching circuit. With a common matching inductor, the effect of magnetic saturation*3 hinders the expected performance. The LQM18JN Series has been designed specifically for NFC matching circuits and is not easily impacted by magnetic saturation. In addition, its closed magnetic circuit configuration suppresses interference with surrounding components even at high mounting density, making it ideal for reducing the size of the NFC circuit.

Rating

Part Number Inductance
Q
(or higher)
Self-Resonance
Frequency
(MHz or higher)
Rated Current
(mA)
Nominal Value
(nH)
Tolerance
(%)
LQM18JNR10J00 100 ±5% 8 200 650
LQM18JNR12J00 120 ±5% 8 150 610
LQM18JNR16J00 160 ±5% 8 100 550

Features

  • Small size at L:1.6×W:0.8×T:0.55mm (Typ.)
  • With ±5% narrow deviation, ideal for matching.

Applications

  • NFC modules mounted in devices such as smartphones.

Part number

LQM18JNxxxx00 (Enter alphanumeric characters at the “x” locations to indicate the inductance and inductance deviation.)
For details see the product page for LQM18JN.

External size

 

Explanation of Terms
*1. NFC: An acronym for Near Field Communication, in a broader sense it encompasses various standards, but generally it indicates use of the 13.56MHz band at which communication is enabled by touching another NFC compliant device.
*2. Impedance matching: In wireless communication circuits, when components of differing specific impedance for a route in which a signal flows are connected, a reflection of the signal occurs, and this lowers the power of the signal being transferred, and it is therefore linked to a decrease in the sensitivity of the wireless circuit. To counter this, an impedance matching circuit is inserted between components of differing specific impedance so that reflection does not occur, and the related operation is called impedance matching.
*3. Magnetic saturation: When a large current flows with an inductor having a strong magnetic body such as ferrite, a phenomenon is generated wherein the inductance drops. This is called magnetic saturation of the inductor. When magnetic saturation of the inductor is generated in a matching circuit, the inductance falls and therefore the inductance required for matching cannot be maintained, and this lowers the precision of the matching.

Related

Recent Posts

TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

16.4.2026
5

Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

16.4.2026
5

Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

15.4.2026
8

YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

15.4.2026
10

YAGEO Introduces EMI Suppression High‑Current 3‑phase Common Mode Chokes

14.4.2026
18

ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

13.4.2026
29

Coilcraft Unveils Molded Power Inductors for High‑Current VRMs

8.4.2026
39

Bourns Releases Compact High Current Shielded Power Inductors

2.4.2026
29

March 2026 Interconnect, Passives and Electromechanical Components Market Insights

2.4.2026
96

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version