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    Bourns Releases High Inductance Common Mode Choke

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    High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

    Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

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    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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Passive Components on Radar Screen of the 23rd CMSE Components for Military & Space Electronics Conference & Exhibition

18.2.2019
Reading Time: 2 mins read
A A

Source: CMSE news

One of the core focus of this year’s CMSE 2019, April 16-18th, 2019 Los Angeles, California, USA are discussion and trainings on high reliability passive components. A full day comprehensive Passive Component Reliability Workshop course will be presented in three sessions covering capacitors, inductors and resistors by industry fellow lecturers.

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High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

The training class on Passive Component Reliability Workshop includes: (pdf flyer download here):

Capacitors

Tantalum & Electrolytic Capacitors (Dr. Yuri Freeman, Kemet), MLCC & EMI filters (John Marshall, AVX) and SuperCapacitors, Film & Thin film capacitors (Chris Reynolds, AVX).

Students will gain an understanding of capacitor construction and how performance characteristics are affected by time, temperature, voltage and frequency. End applications are discussed along with reliability expectations, common failure modes and de-rating methods for increased lifetime performance. Processing guidelines are presented and the availability and use of simulation models is shown.

Inductors

The Inductor performance, reliability and selection session will be taught by (Scott Harris, Vanguard Electronics). This course will outline the basics of magnetics from an RF and power inductor and transformers point of view. Material performance, core types and properties along with wire types, winding techniquesand patterns are shown relative to their impact upon performance. Reliability predictions and levels are discussed along with a preview of emerging technologies and device simulation techniques.

Resistors

Resistor theory, performance & reliability will be taught by (Bryan Yarborough,Vishay). Resistor types and materials will be discussed relative to component performance. Device characteristics and performance relative to time, temperature, frequency and power are discussed. Heat transfer means and noise characteristics outlined. Reliability expectations and recommended applications are given.

 


The CMSE Program At a Glance:

Tutorials:

Copper Wirebonding – A Technology Review
by Mukul Saran, Texas Instruments

Advanced Integrated Circuit Packaging and Reliability Issues
by Richard Rao, Ph.D., Microchip Technology, Inc.

Moisture in Microelectronics… Volatiles Control in Hermetic Electronic Components
by Thomas Green, TJ Green Associates LLC
and Robert Lowry, Electronic Materials Consultant

Passive Component Reliability Workshop
by Dr. Yuri Freeman, Kemet
John Marshall, AVX
Chris Reynolds, AVX
Scott Harris, Vanguard Electronics

Keynotes:

MLCC Shortages: FY 2019 Tier-To-Tier replacement Strategies and Alternative Reference Design Solutions
by Dennis Zogbi, Paumanok Publications, Inc.

Flexibility and Innovation in Military Systems
by Jonathan Ahlbin, MDA

Panel Discussion:

Mil/Aerospace Talent Gap… How to Attract and Retain Young Engineers (1.5 Hrs)
Panelists:
Rick Rodriguez, Component Engineering Mgr., Raytheon Missile Systems
Roz Morrison, HR Manager, Raytheon Missile Systems
Dr. Michael Hamilton, Auburn University, Director, Alabama Micro/Nano Science & Technology Center

Moderator:
Tom Green, TJ Green Associates LLC

Sessions

Session #1: Passive Components for Military and High Rel Space Systems

Session #2: Advanced Packaging for Military and Aerospace

Session #3: RF and Power GaN Technology

Session #4: Component Technology Reliability Issues and the Trusted Supply Chain

 

CMSE homepage link is here.

The direct link to detailed Advanced Program is here.

 

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