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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
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Paumanok Releases January 2020 Passive Electronic Components Monthly Market Research Report

21.4.2020
Reading Time: 2 mins read
A A

Paumanok Inc. release its CRL Monthly Review focused to Passive Electronic Component. Monthly Report: JANUARY 2020 Review

JANUARY 2020 MARKET UPDATE:

RelatedPosts

Paumanok Releases Passive Electronic Components: World Market Outlook: 2020-2025

Paumanok Releases Market Report on High-Reliability Inductors World Markets, Technologies & Opportunities 2019-2024

Paumanok Release Market Research on Circuit Protection Components World Markets, Technologies & Opportunities: 2019-2024

  • The Capacitor Market Index Declined by 5.2% in January on a Month-to-Month Basis With Weakness in The MLCC, Tantalum and Aluminum Segments
  • The Declines In Capacitors Were Lead by Sharp Drops in Demand for MLCC, especially sharp declines in pico-farad and high cap MLCC.
  • Demand In Tantalum Which Began in November and Continued in December, Lost Steam in January and Slowed Down.
  • Film Capacitor Supply Chains Remained Off Balance as Demand Continued to Increase for Axial and Radial Leaded Designs amidst Heightened Demand for Snubber X/Y Caps 
  • Resistor lead times increase
  • Inductor lead times increase
  • Copper price rises 35% for the month:
  • Palladium prices increase 23% during the month
  • Capacitor lead times DECREASE
  • December 2019 Quarter Downgraded to -3% Q-to-Q Instead of Flat
  • March 2020 quarter outlook- down 8% in value quarter-to-quarter
  • AVX DOWN 8%, WALSIN DOWN 10%, YAGEO DOWN 5%, SEMCO Down 5.5% Q-TO-Q FOR DECEMBER.

QUICK MESSAGE:

  • Weak Component MARKETS, ESPECIALLY CAPACITORS
  • RESISTORS AND INDUCTORS SHOWING SIGNS OF A TURNAROUND
  • RAW MATERIALS PRICES SPIKING- PALLADIUM AND COPPER UP SHARPLY
Thin FIlm Resistors Leadtime Jan 2013 – Jan 2020; source: Paumanok Inc.
Check Price & Order

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