Partial vias play a decisive role in the miniaturization of printed circuit boards. Learn more insights in this Würth Elektronik Webinar.
These are buried vias and microvias, which can be combined in different ways. We call microvias placed directly in solder pads “microvia-in-pad”. This saves valuable space, and since microvias are very small blind holes, they can also be integrated into very small solder pads. This is crucial for unbundling miniaturized or complex components such as micro BGAs.
In this webinar, learn more about
- our sample WE.microbga and what you can learn from it
- the current design rules of the MICROVIA.hdi technology and their application
- the routing of a BGA component with pitch 0.4 mm
- the advantages of MICROVIA.hdi technology in terms of signal integrity
- impedance calculations
Source:
Würth Elektronik
