Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Pentacentra Transformer Benefits in High-Current Data Center Application

16.2.2024
Reading Time: 4 mins read
A A

This article is based on newsletter blog written by Dr. Chema Molina, CEO of Frenetic that introduces pentacentra transformer topology for multiphase LLC converter in high-current data center applications.

The data centers consume more than 1,5% of the electric energy in the US, and researchers have been creating innovative solutions to improve efficiency.

RelatedPosts

Transformer Losses and Thermal Design: Modelling and Validation

5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

The transformer topology most commonly used during the 2010s has been the LLC.

More than ten years ago, CPES published some articles and videos about this type of solution for LLC converters, where the idea was to integrate the transformer in the PCB, being very close to the switching devices, allowing very high switching frequencies up to 1MHz.

LLC converter with matrix transformer topology
LLC converter with matrix transformer – PCB example

A new article by Chang Wang from the Technical University of Denmark and from the department led by Professor Andersen was published in TPEL about a new transformer configuration, the Pentacentra Transformer.

The main difference between the matrix and the Pentacentra is a central bar serving as the fifth leg of the core. The goal of adding this additional leg is to reduce by 40% the layout of the windings in the PCB. From my perspective, I would say it increases the complexity of the core, decreases the complexity of the PCB layout, and improves the overall efficiency.

Pentacentra transformer core construction and layout reduction

The article explains with all detail the position of the rectifiers in the secondary, the current flowing paths.

They use the material ML91s from Hitachi. Very popular material in high-frequency publications.

GaN vs Si-FET

Another exciting thing that came out with the experimental results of the article is the comparison between the two prototypes. One uses GaN devices, and the second one uses Si. It’s the same board size.

The author explains that he needed to stop the test at 450 W in the GaN case because the device’s heat dissipation was worse than the Si-FET.

GaN devices are smaller than Si-FET, so, the heat dissipation capacity is smaller. Finally, he finished the tests with the Si-FET devices reaching 98% efficiency and 96% at full power. I would love to see if there was a way of improving the GaN heat dissipation without increasing the cost.

Abstract:

The role of data centers has become significant in the era of information technology, and their operation consumes a substantial amount of energy. Therefore, the point-of-load converter or voltage regulation module used in data centers must have high efficiency and power density to deliver a large current to specific servers. A common bus voltage 48 V at the rack stage needs to be stepped down to intermediate bus voltage, which is 6–5 V in this case. To achieve this, a new pentacentra transformer was developed for a four-phase LLC converter. A centra bar serving as the fifth leg of the core is added to the conventional four-leg matrix transformer. The interleaving and integration of windings in the proposed pentacentra transformer enabled balanced current sharing and reduced conduction loss by 45% compared to the traditional winding layout. The experimental prototype of the converter was designed to achieve 800 W power output at a switching frequency of 500 kHz and 48 V–40 V/6 V–5 V voltage conversion. The peak efficiency achieves 98.1% along with the power density of 240 W/in 3 with the experimental result. Without the heatsink, the whole converter is operating at rated power within a safe temperature lower than 86°. The excellent thermal performance ensures the reliable operation of the converter and promises a larger power delivery capability.

Reference

[1] “Pentacentra Transformer for Multiphase LLC Converter in High-Current Data Center Application” Chang Wang , Student Member, IEEE, Mingxiao Li , Member, IEEE, Ziwei Ouyang , Senior Member, IEEE, Tiberiu-Gabriel Zsurzsan , Member, IEEE, and Michael A.E. Andersen , Member, IEEE

Related

Source: Frenetic

Recent Posts

VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

12.11.2026
63
Würth Elektronik ABC of Thermal Management textbook

Würth Elektronik Launches ABC of Thermal Management Guide

11.11.2026
18
Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

Tantalum Anode Design Combines Structural Benchmarks and Modeling

9.11.2026
21
Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

6.11.2026
28
Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

6.11.2026
30
Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

5.11.2026
27
YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

5.11.2026
20

Transformer Losses and Thermal Design: Modelling and Validation

4.11.2026
25
Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

4.11.2026
48

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved