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    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

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    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Wk 45 Electronics Supply Chain Digest

    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Trending Tags

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Project for Energy Storage on a Chip for MEMS

2.3.2018
Reading Time: 2 mins read
A A
source: FEEC Brno University of Technology, EPCI e-Symposium

Abstract:

A new project with a budget of 262 thousands Euro was motivated by the lack of micromachined energy storage solutions that can be integrated with a MEMS harvester on a chip with a specific circuitry. These key components of the system are highly needed for autonomous microsystems and have to be integrated to enable an energy-autonomous, but efficient operation The targeted energy storage device needs to be charged very slowly from harvesters with output energies in the μWs range. As a consequence, tailored materials and technologies for the realization of thin-film capacitors compatible with CMOS technology are of utmost importance. Target capacitance value about one hundred μF/cm2, low loss factor and low leakage currents are the expected properties of these devices.

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Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

 


Title: Project for Energy Storage on a Chip for MEMS
Author(s): Hubálek1, M. Schneider1,2, R. Hrdý1, J. Prášek1, U. Schmid1,2
Organisation(s):
1Centre SIX, Department of Microelectronics, FEEC, Brno University of Technology, Technická 3058/10, 616 00 Brno, Czech Republic
2 Institute of Sensor and Actuator Systems, TU Wien, Gusshausstrasse 27-29, Vienna, Austria
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: paper 5.4.  Application Session., PCNS2017 Proceedings Pg.113-116
ISBN: 978-80-905 768-8-9
e-Sessions  Applications: Commercial
e-Sessions Scope Components: Capacitors
e-Sessions Topics: Materials, Technology


read the full paper in pdf here.

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