Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samtec Expands Connector Severe Environment Testing Offering

    Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

    YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

    Enhancing Energy Density in Nanocomposite Dielectric Capacitors

    Advances in the Environmental Performance of Polymer Capacitors

    Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

    Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

    Paumanok Releases Capacitor Foils Market Report 2025-2030

    Modelithics Welcomes CapV as a Sponsoring MVP

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samtec Expands Connector Severe Environment Testing Offering

    Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

    YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

    Enhancing Energy Density in Nanocomposite Dielectric Capacitors

    Advances in the Environmental Performance of Polymer Capacitors

    Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

    Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

    Paumanok Releases Capacitor Foils Market Report 2025-2030

    Modelithics Welcomes CapV as a Sponsoring MVP

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers expand microchip capability with new 3D inductor technology

24.1.2020
Reading Time: 3 mins read
A A

Smaller is better when it comes to microchips, researchers from said, and by using 3D components on a standardized 2D microchip manufacturing platform, developers can use up to 100 times less chip space. A team of engineers has boosted the performance of its previously developed 3D inductor technology by adding as much as three orders of magnitudes more induction to meet the performance demands of modern electronic devices.

Featured video: A video of the rolling progress of a 1-cm-long microinductor played-back at 10-times speed. The electrical contacts are at the bottom of the device. Reprinted with permission from X. Li et al., Science Advances (2020).

RelatedPosts

Samtec Expands Connector Severe Environment Testing Offering

Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

In a study led by Xiuling Li, an electrical and computer engineering professor at the University of Illinois and interim director of the Holonyak Micro and Nanotechnology Laboratory, engineers introduce a microchip inductor capable of tens of millitesla-level magnetic induction. Using fully integrated, self-rolling magnetic nanoparticle-filled tubes, the technology ensures a condensed magnetic field distribution and energy storage in 3D space – all while keeping the tiny footprint needed to fit on a chip. The findings of the study are published in the journal Science Advances.  

Traditional microchip inductors are relatively large 2D spirals of wire, with each turn of the wire producing stronger inductance. In a previous study, Li’s research group developed 3D inductors using 2D processing by switching to a rolled membrane paradigm, which allows for wire spiraling out of plane and is separated by an insulating thin film from turn to turn. When unrolled, the previous wire membranes were 1 millimeter long but took up 100 times less space than the traditional 2D inductors. The wire membranes reported in this work are 10 times the length at 1 centimeter, allowing for even more turns – and higher inductance – while taking up about the same amount of chip space.

“A longer membrane means more unruly rolling if not controlled,” Li said. “Previously, the self-rolling process was triggered and took place in a liquid solution. However, we found that while working with longer membranes, allowing the process to occur in a vapor phase gave us much better control to form tighter, more even rolls.”

Another key development in the new microchip inductors is the addition of a solid iron core. “The most efficient inductors are typically an iron core wrapped with metal wire, which works well in electronic circuits where size is not as important of a consideration,” Li said. “But that does not work at the microchip level, nor is it conducive to the self-rolling process, so we needed to find a different way.”

To do this, the researchers filled the already-rolled membranes with an iron oxide nanoparticle solution using a tiny dropper.

“We take advantage of capillary pressure, which sucks droplets of the solution into the cores,” Li said. “The solution dries, leaving iron deposited inside the tube. This adds properties that are favorable compared to industry-standard solid cores, allowing these devices to operate at higher frequency with less performance loss.”

Though a significant advance on earlier technology, the new microchip inductors still have a variety of issues that the team is addressing, Li said.

“As with any miniaturized electronic device, the grand challenge is heat dissipation,” she said. “We are addressing this by working with collaborators to find materials that are better at dissipating the heat generated during induction. If properly addressed, the magnetic induction of these devices could be as large as hundreds to thousands of millitesla, making them useful in a wide range of applications including power electronics, magnetic resonance imaging and communications.”

Researchers from Stanford University, Hefei University of Technology, China, and the University of Twente, The Netherlands also participated in this study.

Li also is affiliated with the department of mechanical science and engineering, the Materials Research Laboratory and the Beckman Institute for Advanced Science and Technology at the U. of I.

The National Science Foundation Engineering Research Center for Power Optimization of Electro-Thermal Systems and the U.S. Department of Energy supported this research.

The paper “Monolithic mtesla-level magnetic induction by self-rolled-up membrane technology” is available online and from the U. of I. News Bureau. DOI: 10.1126/sciadv.aay4508

Related

Source: Illinois News Bureau

Recent Posts

YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

9.10.2025
13

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
15

Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

8.10.2025
11

Experimental Evaluation of Wear Failures in SMD Inductors

1.10.2025
41
a Schematic diagram of the BNT-based components constructed based on the entropy-increase strategy. b Digital photograph, cross-sectional SEM image, and EDS mappings of the MLCCs. c Unipolar P-E loops of MLCCs as a function of applied E. d Wrec and η of the MLCCs as a function of applied E. The comparison of (e) Wrec and η, (f) η and UF of the MLCCs with those of other recently reported state-of-the-art MLCCs. source: Nature Communications

Researchers Proposed Enhanced Energy Storage MLCC

1.10.2025
19

Development of Nitrogen-Doped Graphene Supercapacitors 

30.9.2025
12

Efficient Power Converters: Duty Cycle vs Conduction Losses

29.9.2025
34

Passive Components J-STD-075 Process Sensitivity Level Classification And Labeling

25.9.2025
60

Bourns Releases Semi-Shielded Power Inductor with Polarity Control

25.9.2025
14

Quality Challenges and Risk Mitigation for Passive Components in Harsh Environments

24.9.2025
48

Upcoming Events

Oct 14
16:00 - 17:00 CEST

Smart Sensors, Smarter AI: Building Reliable Edge Systems

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version