Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

    Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

    Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression

    SCHURTER Releases Intelligent Three‑Terminal Fuses for Safer Li‑ion Battery Systems

    Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

    Square-Wave Harmonics and RMS Currents in Power Converters

    LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

    Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

    Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression

    SCHURTER Releases Intelligent Three‑Terminal Fuses for Safer Li‑ion Battery Systems

    Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

    Square-Wave Harmonics and RMS Currents in Power Converters

    LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 11 Electronics Supply Chain Digest

16.3.2026
Reading Time: 6 mins read
A A


Electronics Supply Chain Weekly Digest 3-13-26.

DATAPOINT OF THE WEEK: Passenger car retail sales in China totaled 1.03M in Feb, down 25.4% Y/Y and 33% M/M, according to the China Passenger Car Association (CPCA).

RelatedPosts

Wk 27 Electronics Supply Chain Digest

Wk 26 Electronics Supply Chain Digest

June 2026 Interconnect, Passives and Electromechanical Components Market Insights

The slowdown reflects the impact of Chinese New Year and reduced EV policy support. NEV retail sales totaled 464K units, down 33% Y/Y and 22.1% M/M. BEV Feb sales were 278K, down 35% Y/Y and 20.1% M/M. PHEVs were similarly down 28% Y/Y and 25% M/M.

Despite the significant Y/Y declines across the board, NEV exports held strong, totaling 269K units, up 128% Y/Y and contributing to 48.5% of total passenger car exports.

Headlines:

Auto/Transportation

  • BYD open to building a Canada plant and/or acquiring a legacy automaker, rules out US market entry
  • CATL net income surges 42% Y/Y to $10.4B in FY25, driven by strong EV battery sales
  • EU IAA policies raise costs for European automakers as 2035 zero-emission mandate looms and localization required
  • Honda flags first annual loss since 1957, books up to $15.7B in EV restructuring charges on cancelled US models and China writedown
  • Lucid unveils robotaxi concept and mid-size EV platform at investor day, targets ~100K deliveries and cash flow positive by decade’s end
  • Mercedes considers sharing South Africa plant with China’s GWM amid US tariff pressure, according to Bloomberg
  • Mercedes in early talks with Geely to expand partnership beyond Smart EV JV amid pressure from Chinese rivals, according to Bloomberg
  • Nio posts first-ever quarterly profit of $115M, with 4Q revenue surging 76% Y/Y on record deliveries
  • Renault targeting 23% volume growth by 2030 with overseas push, 36 new models, and 40% EV cost cuts
  • Rivian to begin R2 EV deliveries this spring with $58K launch variant, cheaper $45K model by 2027
  • Stellantis in talks with Chinese automakers including Xiaomi to acquire stakes in European brands like Maserati, according to Bloomberg
  • Tesla China-made EV sales surge 91% Y/Y in February, driven by low Feb-25 comparison from Model Y assembly suspension
  • Uber strikes multiyear robotaxi deal with Amazon’s Zoox, launching in Las Vegas this summer
  • New-vehicle transaction prices rise 3.4% Y/Y in February while EV ATP down 1.4% Y/Y, says Cox Automotive
  • Volkswagen 2025 operating profit falls more than 50% Y/Y to €8.9B, misses expectations on tariffs and China weakness
  • Volkswagen reclaims top spot in China car sales with 13.9% share as BYD drops to fourth amid fading EV subsidies, according to CPCA data
  • Zeekr’s updated 007 GT to see price hike of up to $1.1K in 2Q driven by DDR5 memory and battery cost pressures, says DigiTimes

Datacenter

  • Nvidia announced it will invest $2B in Nebius to build next-gen hyperscale AI cloud with 5 GW capacity target by 2030
  • Oracle’s 3Q revenue beats at $17.19B as contract backlog surges 325% Y/Y to $553B on large-scale AI contracts

Industrial

  • EU to launch Strategic Infrastructure Investment Fund to finance €695B annual green energy transition cost
  • Joby Aviation begins certification test flights of first production-model EV air taxi, with production ramp targeted in 2027

IP&E

  • Ayar Labs CEO says mass production remains the key challenge for silicon photonics ahead of 2028 GPU adoption target
  • Sunny Optical, OFILM, and Q Technology pivot to automotive and high-end optics as smartphone reliance fades, according to DigiTimes
  • CPO penetration in AI data centers to hit 35% by 2030 as optical interconnects displace copper beyond one-meter range, per TrendForce
  • Marvell and Mojo Vision partner on next-gen micro-LED optical interconnects for AI data center infrastructure

Semiconductors

  • AMD CEO Lisa Su to meet Samsung chairman Jay Y. Lee in South Korea to discuss HBM supply cooperation, per Maeil Business Newspaper
  • Applied Materials partners with Micron and SK Hynix as founding members of $5B EPIC Center for next-gen HBM and DRAM
  • ByteDance deploys ~36K Nvidia B200 chips in Malaysia via Aolani Cloud in $2.5B+ build-out to power global AI efforts, according to the WSJ
  • Cerebras and AWS announce partnership to combine Cerebras and Trainium3 chips for AI inference in “divide and conquer” approach, service expected 2H26
  • China IC exports surge 69% Y/Y to $41.8B in January-February, according to China’s General Administration of Customs
  • GlobalWafers reports fully loaded 12-inch capacity, guides 2026 revenue flat to slightly higher as silicon wafer prices near bottom
  • Japan sets $253.6B domestic chip sales target by 2040, a fivefold increase from current levels
  • Meta unveils four-chip MTIA roadmap through 2027, MTIA 300 deployed and MTIA 400 next with HBM capacity scaling to 384–512 GB
  • Nexchip to raise foundry prices 10% from June 2026, following SMIC and Hua Hong amid tightening mature-node supply, according to TrendForce
  • Nexperia dispute escalates as China warns of supply chain crisis after Dutch HQ disables employee accounts; Chinese unit begins independent 12-inch wafer production, according to Reuters
  • Nvidia narrows CoWoP PCB partners to Zhen Ding Technology, Unimicron and Kinwongas as advanced packaging validation tightens, according to DigiTimes
  • NXP and TI announce price hikes effective April 1, citing higher raw material, energy, labor, and logistics costs with TI leading at up to 85% on select products
  • Qualcomm and Tata Electronics partner to manufacture automotive modules at India OSAT facility
  • Rapidus secures Canon as first customer for 2nm test chips at Chitose fab site, according to Electronics Weekly
  • Rohm and Toshiba in talks to integrate power semiconductor businesses amid Denso’s $8.2B takeover bid, according to Nikkei
  • Wolfspeed engages AI ecosystem partners to evaluate 300mm SiC substrates for next-gen AI and HPC heterogeneous packaging, says EETimes

Consumer/Other

  • AT&T announces plan to spend $250B+ over five years for fiber and 5G expansion
  • Chile and US sign joint statement to begin critical minerals and rare earths collaboration talks, according to Reuters

Related

Source: Edgewater Research

Recent Posts

Wk 27 Electronics Supply Chain Digest

13.7.2026
46

Wk 26 Electronics Supply Chain Digest

6.7.2026
62

Wk 25 Electronics Supply Chain Digest

29.6.2026
55

Wk 24 Electronics Supply Chain Digest

15.6.2026
67

Wk 23 Electronics Supply Chain Digest

8.6.2026
74

Wk 22 Electronics Supply Chain Digest

1.6.2026
64

Wk 19 Electronics Supply Chain Digest

11.5.2026
116

Wk 18 Electronics Supply Chain Digest

4.5.2026
100

Wk 17 Electronics Supply Chain Digest

27.4.2026
53

Upcoming Events

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

Jul 29
17:30 - 18:30 CEST

To Ferrite or to Nanocrystalline in Transformer Design

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version