Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Restricted MLCC supply focuses on re-design activity

20.6.2018
Reading Time: 5 mins read
A A

Source: Electronics Specifier article

The case sizes of Multi-Layered Ceramic Capacitors (MLCC) available today are seemingly ever shrinking, which coupled with a long term reduction in manufacturing capacity for legacy commodity products and dramatically increasing manufacturer lead times is creating a supply headache for customers in Europe. In this update Adam Fletcher, Chairman of the Electronic Components Supply Network (ecsn) examines the current issues and suggests how they may be overcome.
Passive components (capacitors, resistors, ferrites, coils and inductors) are essential for almost all electronic circuitry, but the machinations of this sector of the electronic components market are rarely discussed in the media, probably because the passive component market is considered to be boringly established and ultra-stable.

RelatedPosts

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

TDK X Series SMD Varistors for Industrial Transient Protection

Engineers, buyers and the wider electronics industry tend to focus their interest primarily on ‘exciting’ developments in microcontrollers and associated firmware and other technology that they can employ to differentiate their end equipment in their market. Passive components represent only a small proportion of the value in most Bills of Material (BOM) and here in the UK only represent approximately 12% of total electronic components sales by revenue.

Capacitor sales account for only 4% of sales by revenue of which half are sales of ceramic capacitors. These figures are slightly higher than the global average, reflecting the UK’s lower manufacturing volumes and our greater use of larger case-sized, more expensive MLCCs.

The quantity of Multi-Layered Ceramic Capacitors (MLCCs) manufactured is staggering, easily exceeding a trillion devices a year but potential threats to their availability of are nothing new. Industry analysts, trade associations, manufacturers and their authorised distributors have been warning about shortages for years.

The average quoted manufacturing lead time for all MLCCs has been over 12 weeks since 2013 but leapt up to 18 weeks in 2017 and this year (2018) MLCC lead times have further extended in leaps and bounds. Fletcher fears that this situation will get worse, especially for older legacy/commodity larger case size MLCCs and will probably reach a peak in mid-2019 before returning to more normal market conditions.

Why is this happening?
No passives manufacturing organisation has ‘ownership’ of legacy commodity MLCCs in the merchant market. They merely add their available product onto the market and accept the market price. This has led to fierce price competition for many years, which has precipitated several ‘boom and bust’ cycles. No surprise therefore that manufacturers have been reluctant to add new manufacturing capacity for legacy parts in the current growth cycle.

Instead passives manufacturers have invested heavily in research into improving the ceramic dielectric materials, electrolyte powders and pastes over the last twenty years which has dramatically reduced the physical size of the devices, whilst increasing their performance, at the same time making many small sequential improvements to their manufacturing processes to increase yields.

The industry leaders are today offering MLCCs with over 1,000 interposing layers, substantially increasing the capacitance of the devices and at the same time boosting stability and reliability. The improved price\performance ratio has enabled engineers to replace many tantalum and electrolytic capacitors with better performing lower priced MLCC devices, enabling the sector to grow at a rate significantly faster than other types of capacitors.

Demand drivers
Demand for MLCCs has been primarily driven by Cellular Mobile Phones, Automotive, Tablet PCs and LED/LCD TVs. Early generations of mobile phones used a mere 50 or so MLCCs but that has dramatically increased over the last 20 years. The iPhone X design employs more than 1,000 MLCCs while more modest (and affordable) modern smartphones have more than 600.

There has also been huge growth in the integration of electronics within the automotive sector. Many internal combustion engine vehicles today use more than 300 MLCCs in both ‘under the hood’ (engine management) applications and in the ‘passenger compartment‘, spanning essential instrumentation, infotainment systems and even seat controls. However, this is probably the very tip of the iceberg, the latest Tesla models of electric cars have over 10,000 MLCCs per vehicle!

Smaller case sizes
The drive to smaller physical MLCC sizes is a compelling economic argument: It takes the same volume of processed dielectric material to produce a single ‘1206’ case size MLCC as it does to produce 128 off ‘0402’ case size MLCCs. It is therefore obvious where manufacturers are concentrating their manufacturing capacity investment.

In 2018 there has been an intersection in the quantities of the two most commonly used MLCC case sizes. The almost 50% market share enjoyed by the ‘0402’ for many years is today declining and the format is being usurped by the ‘0201’ with a growing more than 40% market share. However, over the next five years the predominance of the ‘0201’ case size is likely to decline in favour of the ‘01005’, which already has 10% market share and is growing fast.

Further, forward thinking designers should already be considering the ‘008004’, a device that is taking off rapidly and is already outselling the ‘1206’, albeit that global demand for the 1206 is now small.

A bigger problem In the west?
Mobile phone companies are leading the drive to smaller MLCC case sizes. In addition to the relentless demand for ever thinner phones smaller devices are more suited to the highly automated PCB assembly lines today offered by their primarily Asia-Pac located manufacturing partners. Lower manufacturing volumes in the US and Europe reflect a different mix of end products, which primarily target the industrial, medical, aerospace and automotive markets.

Mobile phones are produced in extremely high volume but have a surprisingly short life cycle. Conversely, the products primarily manufactured in US and Europe are produced in low or moderate volumes so end products often enjoy a 10-15 year life cycle. In addition, the formal process to approve changes is slow and arduous, which is why the demand for commodity legacy MLCCs in Western markets has remained pretty constant.

However, over the next few months it will unfortunately be necessary for design engineers to redesign and possibly requalify the equipment their company produces. This won’t be too much of a problem if the equipment manufactured is approaching the end of its life cycle but could present something of a headache if the equipment is scheduled to remain in production for several more years.

At a minimum the largest MLCC case size they should specify for the redesign should be a ‘0201’ and to really guarantee availability in the longer term, a ‘01005’ would probably be a better choice. Engineers could opt to migrate away from their ‘1206’ case MLCC to other capacitor technologies but this might only be a short term solution as capacity constraints are looming in Tantalum capacitors too.

Conclusion
Not keeping an eye on what’s happening to availability in the passive components market means that organisations may be missing some important intelligence on what are considered ‘jelly bean’ parts. It is almost certain that doing nothing will inevitably result in some very expensive line stops for Western customers in 2019.

The best quality information on how to proceed and avoid this looming problem is invariably available from authorised distributors’ applications teams and Fletcher encourages all organisation to actively engage with their partners throughout their electronic components supply network to find the optimum solution.

 

featured image source: Kemet

Related

Recent Posts

Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
30
Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

13.10.2026
17
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
73
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
26
Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
11
ECIA September 2026 Industry Pulse electronic component trends and sentiment report

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

12.10.2026
28
Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

TT Electronics: Resistor and Sensing Trends at electronica 2026

9.10.2026
13
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
55
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
59

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved