Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

    Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

    YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

    Over-Voltage Protection Clippers, Clampers, Snubbers, DC Restorers

    KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

    Wk 41 Electronics Supply Chain Digest

    Samtec Expands Connector Severe Environment Testing Offering

    Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

    YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

    Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

    YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

    Over-Voltage Protection Clippers, Clampers, Snubbers, DC Restorers

    KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

    Wk 41 Electronics Supply Chain Digest

    Samtec Expands Connector Severe Environment Testing Offering

    Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

    YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Samsung MLCCs Lineup for In-Vehicle Infotainment

4.9.2025
Reading Time: 5 mins read
A A

This article presents Samsung Electro-Mechanics’ lineup of compact, high-capacitance, low-ESL Multi-Layer Ceramic Capacitors (MLCCs) optimized for modern IVI architectures.

In-Vehicle Infotainment (IVI) systems are evolving beyond basic driving information displays to fully integrated entertainment and connectivity hubs. As high-resolution multi-display setups, V2X communication links, and advanced driver-and-passenger features become standard, processors demand rapid power-noise suppression and stable voltage rails under fast current transients.

RelatedPosts

Samsung Electro-Mechanics Releases 470nF 16V MLCC in 0402 Size

Samsung Electro-Mechanics Unveils Ultra-High-Capacitance MLCCs for AI Servers

Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

Advanced Driver Assistance Systems (ADAS) and autonomous driving technologies have redefined in-car electronics. IVI platforms now handle up to eight simultaneous high-resolution displays, Wi-Fi, Bluetooth, emergency call services, and vehicle-to-everything (V2X) communication. These complex tasks require System-on-Chips (SoCs) with high computing throughput and stringent power-integrity demands.

In-Vehicle Infotainment IVI Technology Trends

  • Expansion from single driving-status displays to multi-monitor entertainment and passenger interfaces
  • Integration of V2X, emergency call, Wi-Fi, and Bluetooth networks
  • Increasing reliance on real-time driver monitoring and voice-recognition engines
  • Greater graphics throughput and low-latency data processing

MLCC Requirements for IVI

As IVI processors scale performance:

  1. Miniaturization becomes critical to accommodate more decoupling capacitors in limited PCB real estate.
  2. High capacitance per footprint ensures stable supply during rapid load changes.
  3. Low equivalent series inductance (ESL) is essential for suppressing high-frequency noise on SoC power rails.
  4. Automotive-grade reliability (AEC-Q200) guarantees operation across temperature and vibration extremes.

Proposed MLCC Solutions

Miniaturized, High-Capacitance MLCCs for IVI Head-Units and Displays

Samsung Electro-Mechanics offers three dielectric series tailored for IVI:

SeriesDielectricFootprintsCapacitance RangeVoltage RatingsProduction Status
X6SX6S (AEC-Q200)0201, 04021 nF – 100 µF10 Vdc – 25 VdcMass Production
X5RX5R (AEC-Q200)0201, 04021 nF – 100 µF6.3 Vdc – 35 VdcMass Production
C0GC0G (AEC-Q200)0201, 040210 pF – 33 nF50 Vdc – 100 VdcMass Production

These MLCCs enable tighter power-rail decoupling around CPU cores and GPUs, maintaining low impedance from DC to hundreds of megahertz.

Low-ESL MLCCs for High-Performance SoCs

To address fast switching currents and high-frequency noise, Samsung Electro-Mechanics introduces two low-ESL designs:

TypeConstructionFootprintsCapacitanceVoltageStatus
Reverse Type2-Terminal0204 (0.22 mm), 0510 (0.30 mm), 0.53 mm47 nF, 1 µF, 2.2 µF2.5 V – 50 VMass Production & Under Development
3-Terminal3-Terminal (3T)0402 /1005 (0.50 mm), 0603 /1608 (0.70 mm), 1.35 mm4.3 µF, 10 µF, 4.7 µF2.5 V – 16 VMass Production & Under Development

These low-ESL MLCCs push the self-resonant frequency higher, sharply reducing impedance in the MHz-to-GHz region and ensuring SoC target-impedance requirements are met.

Technology Highlights

Samsung’s IVI-optimized MLCC portfolio leverages:

  • Proprietary fine-particle ceramic dielectrics for maximized volumetric efficiency
  • Advanced electrode materials to boost capacitance density
  • Ultra-precision wafer stacking to achieve sub-0.2 mm thickness and consistent ESL performance
  • Full AEC-Q200 qualification for automotive temperature and mechanical stress resilience

Detailed Product Lineup

Part NumberCategorySize (inch/mm)CapacitanceDielectricRated VoltageSamples & Data Sheet
CL03C220JB31IN#Infotainment0201 / 060322 pFC0G50 VdcAvailable
CL03A105MOR1IN#Infotainment0201 / 06031 µFX5R16 VdcAvailable
CL03X105MPR1IN#Infotainment0201 / 06031 µFX6S10 VdcAvailable
CL05C102JB51IN#Infotainment0402 / 10051 nFC0G50 VdcAvailable
CL05A475MPQ1IN#Infotainment0402 / 10054.7 µFX5R10 VdcAvailable
CL05X475MQQ1IN#Infotainment0402 / 10054.7 µFX6S6.3 VdcAvailable
CLL5Z225MS21PN#Low ESL (Reverse)0204 / 05102.2 µFX7T2.5 VdcAvailable
CLL5Z105MR41PN#Low ESL (Reverse)0204 / 05101 µFX7T4 VdcAvailable
CL05Z105MR41PT#Low ESL (3T)0402 / 10051 µFX7T4 VdcAvailable

Conclusion

Compact, high-capacitance, and low-ESL MLCCs are critical enablers for next-generation IVI systems. Samsung Electro-Mechanics’ proprietary materials and precision stacking technologies deliver automotive-grade components that support multi-display configurations, V2X communication, and high-frequency SoC decoupling.

For inquiries, documentation, or samples, please contact your Samsung Electro-Mechanics representative or submit requests through our product portal.

All listed MLCCs are AEC-Q200 qualified for automotive Infotainment applications.

Related

Source: Samsung Electro-Mechanics

Recent Posts

KYOCERA AVX Expands Stacked MLCC Capacitors Offering

14.10.2025
6

YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

13.10.2025
99

KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

13.10.2025
18

Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

10.10.2025
31

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
28

Advances in the Environmental Performance of Polymer Capacitors

8.10.2025
61

Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

8.10.2025
24

Paumanok Releases Capacitor Foils Market Report 2025-2030

7.10.2025
24

Modelithics Welcomes CapV as a Sponsoring MVP

7.10.2025
4

Benefits of Tantalum Powder Stress–Strain Curve Evaluation vs Conventional Wet Test

3.10.2025
26

Upcoming Events

Oct 15
20:00 - 20:30 CEST

Planar Design & Simulation

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version