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    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

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    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

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    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

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Samtec Webinar: DC Block Capacitor Location (Does It Matter?)

30.1.2025
Reading Time: 1 min read
A A

Have you ever wondered If it’s better to put the DC blocking capacitor close to the driver or close to the receiver? Why? A lot of confusion and friendships have been broken due to this very argument. In this talk, I’ll go back to basics and with the help of simple simulations and theory, I’ll answer those questions.

Gustavo Blando is a Senior Principal Signal Integrity Architect at Samtec, Inc. In addition to his leadership roles, he’s charged with the development of new Signal Integrity/Power Integrity methodologies along with high-speed characterization, tools and modeling. Gustavo has over twenty-five years of practical experience in Signal Integrity and high-speed circuits design and has participated in numerous conference publications

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