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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

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Schurter COTS+ SMD Fuse Surpress Tin Whiskers and Dendrites

17.8.2018
Reading Time: 2 mins read
A A

Source: Schurter news

SCHURTER extends the MGA range of 1206 SMD ceramic fuses to include a COTS+ version for aviation applications. The MGA-A is completely lead-free, while protecting against the formation of tin whiskers and dendrites.

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Crystalline tin dendrites and tin whiskers pose a considerable risk of short circuits in highly dense electronics. Dendrites form during the electro-deposition process, whereby heavy marks could appear on the fuse end caps or housing. A thorough inspection and cleaning is required according to MIL-PRF 23419. Tin whiskers on the other hand form after the electro-deposition process. The cause is not well understood, although adding lead to otherwise pure tin soldering is commonly used as a preventable measure.

The natural element of lead, however, has become known as a toxic element. As such, it is mostly eliminated from soldering through the implementation of environmental initiatives, e.g. RoHS directives. The MGA-A uses gold alternatively to lead. Gold plated end caps provide a surface where neither whiskers nor dendrites can form.

The technical design of the MGA-A is essentially the same as the MGA COTS version and the MGA-S, which is the version up-screened for European Space Agency (ESA) qualification and ESCC listing. With its ultra-robust thin-film construction, hermetic seal, and operating temperature range of -55°C to +125 °C, the MGA-A is a safe solution for use in not only highly sensitive electronics in the aviation industry, but also in widespread industrial-grade applications including intrinsically safe applications according to ATEX and IECEx requirements.

The MGA-A is cURus approved for 0.2 A – 5 A, with a particularly high breaking capacity of up to 300 A at 125 VDC for currents up to 3A; 32 VDC for 4 and 5 A versions. Humidity and moisture tested to MIL STD 202. Shock and vibration tested to IEC 60068-2. Pricing for the series is $2.68 each/500.

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