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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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Schurter COTS+ SMD Fuse Surpress Tin Whiskers and Dendrites

17.8.2018
Reading Time: 2 mins read
A A

Source: Schurter news

SCHURTER extends the MGA range of 1206 SMD ceramic fuses to include a COTS+ version for aviation applications. The MGA-A is completely lead-free, while protecting against the formation of tin whiskers and dendrites.

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Crystalline tin dendrites and tin whiskers pose a considerable risk of short circuits in highly dense electronics. Dendrites form during the electro-deposition process, whereby heavy marks could appear on the fuse end caps or housing. A thorough inspection and cleaning is required according to MIL-PRF 23419. Tin whiskers on the other hand form after the electro-deposition process. The cause is not well understood, although adding lead to otherwise pure tin soldering is commonly used as a preventable measure.

The natural element of lead, however, has become known as a toxic element. As such, it is mostly eliminated from soldering through the implementation of environmental initiatives, e.g. RoHS directives. The MGA-A uses gold alternatively to lead. Gold plated end caps provide a surface where neither whiskers nor dendrites can form.

The technical design of the MGA-A is essentially the same as the MGA COTS version and the MGA-S, which is the version up-screened for European Space Agency (ESA) qualification and ESCC listing. With its ultra-robust thin-film construction, hermetic seal, and operating temperature range of -55°C to +125 °C, the MGA-A is a safe solution for use in not only highly sensitive electronics in the aviation industry, but also in widespread industrial-grade applications including intrinsically safe applications according to ATEX and IECEx requirements.

The MGA-A is cURus approved for 0.2 A – 5 A, with a particularly high breaking capacity of up to 300 A at 125 VDC for currents up to 3A; 32 VDC for 4 and 5 A versions. Humidity and moisture tested to MIL STD 202. Shock and vibration tested to IEC 60068-2. Pricing for the series is $2.68 each/500.

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