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    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

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    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Vishay Releases High Current 3.3 V to 36 V ESD Protection Diodes

    TDK Extends SMT Gate Drive Transformers to 1000 V

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Researchers Demonstrated HfO Anti-Ferroelectric Flexible Capacitors

    Connector Industry Achieves Double-Digit Growth

    Stackpole Unveils Metal Element High Current Chip Jumpers

    Common Mistakes in Flyback Transformer Specs

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    • Tantalum vs Ceramic
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    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

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Schurter COTS+ SMD Fuse Surpress Tin Whiskers and Dendrites

17.8.2018
Reading Time: 2 mins read
A A

Source: Schurter news

SCHURTER extends the MGA range of 1206 SMD ceramic fuses to include a COTS+ version for aviation applications. The MGA-A is completely lead-free, while protecting against the formation of tin whiskers and dendrites.

RelatedPosts

SEPIC Converter with Coupled and Uncoupled Inductors

Coupled Inductors in SEPIC versus Flyback Converters

Vishay Releases High Current 3.3 V to 36 V ESD Protection Diodes

Crystalline tin dendrites and tin whiskers pose a considerable risk of short circuits in highly dense electronics. Dendrites form during the electro-deposition process, whereby heavy marks could appear on the fuse end caps or housing. A thorough inspection and cleaning is required according to MIL-PRF 23419. Tin whiskers on the other hand form after the electro-deposition process. The cause is not well understood, although adding lead to otherwise pure tin soldering is commonly used as a preventable measure.

The natural element of lead, however, has become known as a toxic element. As such, it is mostly eliminated from soldering through the implementation of environmental initiatives, e.g. RoHS directives. The MGA-A uses gold alternatively to lead. Gold plated end caps provide a surface where neither whiskers nor dendrites can form.

The technical design of the MGA-A is essentially the same as the MGA COTS version and the MGA-S, which is the version up-screened for European Space Agency (ESA) qualification and ESCC listing. With its ultra-robust thin-film construction, hermetic seal, and operating temperature range of -55°C to +125 °C, the MGA-A is a safe solution for use in not only highly sensitive electronics in the aviation industry, but also in widespread industrial-grade applications including intrinsically safe applications according to ATEX and IECEx requirements.

The MGA-A is cURus approved for 0.2 A – 5 A, with a particularly high breaking capacity of up to 300 A at 125 VDC for currents up to 3A; 32 VDC for 4 and 5 A versions. Humidity and moisture tested to MIL STD 202. Shock and vibration tested to IEC 60068-2. Pricing for the series is $2.68 each/500.

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