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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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Taiwan Passive Component Makers Optimistic for 2Q21

14.4.2021
Reading Time: 2 mins read
A A

Taiwan’s passive components vendors are optimistic their shipments for second-quarter 2021 will continue to be bolstered by strong demand for automotive, stay-at-home and 5G applications, according to industry sources.

This year, the passive components supply chain will still follow traditional seasonal patterns with shipments continuing rising through the third quarter before declining slightly in the fourth, the sources said.

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Shipments of passive components could expand faster if IC shortages ease, the sources noted, adding that both vendors and clients are facing low inventory levels due to strong demand for terminal applications.

Top passive component vendor Yageo has seen its capacity utilization for MLCCs ramping up to over 90% in the second quarter from over 80% in first-quarter, and its chip resistor capacity utilization is also advancing to over 80% from 70-80%.

Walsin Technology expects its shipments of passive components to surge steadily in the months ahead on stable expansion in demand for datacenter, server, EV and networking applications.

Inductor makers Chilisin Electronics, Tai-Tech Advanced Electronics and ABC Taiwan Electronics are all optimistic that strong demand for networking and automotive applications will further power their shipment and revenue increases in 2021, with order visibility extending to six months for popular-specs offerings.

Upstream materials and equipment vendors Ample Electronic Technology, LaserTek Taiwan and Tian Zheng International Precision Machinery have also seen clear order visibility extend to the third quarter, particularly orders for conductive pastes and SMT packaging materials.

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Source: DigiTimes

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