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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

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Taiwan Passive Component Makers Optimistic for 2Q21

14.4.2021
Reading Time: 2 mins read
A A

Taiwan’s passive components vendors are optimistic their shipments for second-quarter 2021 will continue to be bolstered by strong demand for automotive, stay-at-home and 5G applications, according to industry sources.

This year, the passive components supply chain will still follow traditional seasonal patterns with shipments continuing rising through the third quarter before declining slightly in the fourth, the sources said.

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Shipments of passive components could expand faster if IC shortages ease, the sources noted, adding that both vendors and clients are facing low inventory levels due to strong demand for terminal applications.

Top passive component vendor Yageo has seen its capacity utilization for MLCCs ramping up to over 90% in the second quarter from over 80% in first-quarter, and its chip resistor capacity utilization is also advancing to over 80% from 70-80%.

Walsin Technology expects its shipments of passive components to surge steadily in the months ahead on stable expansion in demand for datacenter, server, EV and networking applications.

Inductor makers Chilisin Electronics, Tai-Tech Advanced Electronics and ABC Taiwan Electronics are all optimistic that strong demand for networking and automotive applications will further power their shipment and revenue increases in 2021, with order visibility extending to six months for popular-specs offerings.

Upstream materials and equipment vendors Ample Electronic Technology, LaserTek Taiwan and Tian Zheng International Precision Machinery have also seen clear order visibility extend to the third quarter, particularly orders for conductive pastes and SMT packaging materials.

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Source: DigiTimes

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