Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Tantalum Capacitors Support Nvidia to Shrink AI ‘Supercomputer’ to Credit Card Size

9.11.2019
Reading Time: 3 mins read
A A

by: EPCI blog

NVIDIA today introduced Jetson Xavier™ NX, the world’s smallest, most powerful AI supercomputer for robotic and embedded computing devices at the edge. What grabbed my attention looking at the board are six tantalum capacitors on the board that enables such miniaturization. 

RelatedPosts

Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

Nvidia Jetson Xavier “AI Supercomputer” features

With a compact form factor smaller than the size of a credit card, the energy-efficient Jetson Xavier NX module delivers server-class performance up to 21 TOPS for running modern AI workloads, and consumes as little as 10 watts of power.

Jetson Xavier NX opens the door for embedded edge computing devices that demand increased performance but are constrained by size, weight, power budgets or cost. These include small commercial robots, drones, intelligent high-resolution sensors for factory logistics and production lines, optical inspection, network video recorders, portable medical devices and other industrial IoT systems.

“AI has become the enabling technology for modern robotics and embedded devices that will transform industries,” said Deepu Talla, vice president and general manager of Edge Computing at NVIDIA. “Many of these devices, based on small form factors and lower power, were constrained from adding more AI features. Jetson Xavier NX lets our customers and partners dramatically increase AI capabilities without increasing the size or power consumption of the device.”

Ecosystem Support
Jetson Xavier NX is receiving strong support from the robotics and embedded devices ecosystem.

“NVIDIA’s embedded Jetson products have been accelerating the research, development and deployment of embedded AI solutions on Lockheed Martin’s platforms,” said Lee Ritholtz, director and chief architect of Applied Artificial Intelligence at Lockheed Martin. “With Jetson Xavier NX’s exceptional performance, small form factor and low power, we will be able to do more processing in real time at the edge than ever before.”

“Our goal is to dramatically increase the quality and accuracy of our optical inspection system and accelerate our move towards industry 4.0,” said Otsuka Hiroshi, CEO of Musashi Seimitsu. “NVIDIA Jetson Xavier NX gives us the compute capabilities to improve our visual inspection capabilities without increasing the size and power of our optical inspection system.”

Nvidia Jetson Xavier NX module with six tantalum capacitors on the board; modified from source: Nvidia

Tantalum Capacitors Challenges

Last month I was presenting “Tantalum Capacitors Future” at T.I.C. 60th General Assembly in Hong Kong and the news on the Nvidia compact AI supercomputer with tantalum capacitors on board nicely fit and complete the picture.

We have seen some decrease of global tantalum capacitor market and there were some doubts about the technology future, nevertheless there are some three strong pillars for tantalum capacitors based on their features:

  1. High stability of its parameters
  2. Long-term reliability
  3. High energy and power density

While high volume consumer market is trying to replace tantalum capacitors due to the higher cost there are still number of applications where use of tantalum capacitors presents key competitive advantage within consumer-industrial applications (such as high energy compact capacitors in SSDs and industrial computers) and high reliability and defense sector.

There were two web articles that grab my attention this morning as puzzle piece to complete the picture. The first release from Nvidia on “industrial” supercomputer above and also nice overview of defense industry technology innovation from Jabil blog discussion role of defense in driving the technology innovation.  The blog mentions four technology innovations impacting the defense industry:

  1. Augmented and Virtual Reality
  2. Big Data and the Internet of Things
  3. Artificial Intelligence
  4. Additive Manufacturing

The Jabil blog goes nicely with the Nvidia press release citing Lockheed Martin’s acknowledgement for the AI supercomputer development … and at the end is a good message for tantalum capacitor industry.

Related

Recent Posts

Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

8.9.2026
1
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
11

Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

7.9.2026
1

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
34

AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

4.9.2026
7

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

4.9.2026
30

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

3.9.2026
14

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
58

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

3.9.2026
36

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved