Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Peak Nano to Develop Fusion Grade High Energy Film Capacitors

11.3.2026
Reading Time: 4 mins read
A A

Peak Nano and E&P Technologies have announced a partnership to co‑develop fusion‑grade, high‑energy‑density film capacitors based on Peak Nano’s NanoPlex HDC dielectric platform, manufactured in the United States.

The collaboration is aimed at pushing pulsed‑power film capacitor performance beyond conventional polymer films while also addressing U.S. supply‑chain resilience for fusion energy, aerospace, aviation and power grid modernization.

RelatedPosts

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

Key features and benefits

The joint development centers on high‑energy‑density capacitors using Peak Nano’s NanoPlex HDC nanolayer film as the dielectric. The material is engineered by arranging multiple polymers in precisely controlled nanoscale layers to tune electrical, thermal and mechanical behavior.

Key attributes highlighted by the partners include:

  • High energy density compared with traditional polymer dielectric films, enabling more compact capacitor banks or higher stored energy in a given volume.
  • Improved thermal stability, supporting higher operating temperatures and better performance in tightly packed power electronics and pulsed‑power assemblies.
  • Enhanced electrical reliability and high‑duty‑cycle robustness, targeting “million‑shot” operation in fusion drivers and other pulsed‑power systems.
  • U.S.‑manufactured dielectric film and domestic capacitor manufacturing, intended to reduce dependence on foreign film supply and support policy goals around secure, on‑shore production.

From a design perspective, the use of nanolayer polymer stacks allows optimization of dielectric strength and loss behavior; in practical terms, this supports higher specific energy storage J/cm3\text{J/cm}^3J/cm3 at given voltage levels while controlling self‑heating in repetitive‑pulse duty.

Typical applications

Although specific electrical ratings will be defined at the product level, the partnership explicitly targets demanding use cases where energy density, duty‑cycle capability and reliability are critical:

  • Fusion energy drivers and pulsed‑power stages requiring repetitive high‑current discharge over million‑shot lifetimes.
  • Aerospace and aviation power electronics where volume, weight and environmental robustness are tightly constrained.
  • Defense pulsed‑power systems and other mission‑critical platforms needing high reliability and secure supply chains.
  • Power grid modernization, especially grid‑enhancing technologies for increasing transmission capacity and stability on existing infrastructure.
  • Advanced power electronics in sectors such as heavy industrial operations, where compact high‑energy film capacitors can support fast pulsed loads or high‑power conversion stages.

In many of these applications, the capacitors will function as main energy‑storage elements in pulsed power blocks, pulse‑forming networks, or high‑voltage DC link stages where cycle life and field reliability are as important as the nameplate capacitance and voltage rating.

Technical highlights

The press information focuses on the dielectric platform and manufacturing approach rather than listing specific part numbers. Key technical themes relevant to capacitor specifiers include:

  • NanoPlex HDC dielectric film technology: multiple polymer layers arranged at the nanoscale to achieve a tailored combination of dielectric strength, permittivity, loss tangent and mechanical robustness.
  • High‑duty‑cycle design: the capacitors are intended for “million‑shot” pulsed‑power service, which implies careful control of partial discharge behavior, dielectric heating and electrode/termination design according to manufacturer datasheets.
  • Thermal performance: improved thermal stability versus conventional films supports higher ripple loading or closer packing, but the exact temperature ratings and allowable hot‑spot limits are to be taken from the manufacturer datasheets for each capacitor series.
  • U.S.‑based manufacturing flow: material development, film production and capacitor manufacturing/qualification are integrated within a domestic supply chain, supporting programs that emphasize domestic content and secure sourcing.

For engineers used to standard polypropylene or polyester film capacitors, the main shift with a nanolayer platform is the potential to trade conventional margins (package size, voltage derating, operating temperature) for higher energy density and lifetime in a defined pulsed‑duty envelope, provided the application remains within the manufacturer’s validated operating area.

Source

This article is based on information released by Peak Nano regarding its strategic partnership with E&P Technologies to co‑develop high‑energy‑density capacitors using NanoPlex HDC dielectric films, complemented with general engineering context relevant to film capacitor selection and design‑in.

References

  1. Peak Nano press release: Partnership with E&P Technologies to develop fusion‑grade high‑energy‑density capacitors

Related

Recent Posts

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
9
ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

11.9.2026
7

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
22

Emerging Capacitor Markets in Fusion Energy

10.9.2026
29
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
63
Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

9.9.2026
12

SCHURTER THT DIP Switches Support Hardware-Level Configuration

9.9.2026
3
TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

9.9.2026
14
Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

9.9.2026
12

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved