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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
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TDK announces corporate venture entity to invest in start ups

3.7.2019
Reading Time: 2 mins read
A A

Source: TDK news

TDK Corporation (TSE: 6762) today announced it has established TDK Ventures, Inc., a corporate venture company (CVC) to invest in early-stage innovative startups to bolster innovation in material science, energy/power and related areas typically underrepresented in venture capital portfolios. TDK Ventures, established as a wholly-owned subsidiary of TDK Corporation, will have an initial fund size of $50 million.

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Bourns Introduces Precision Thin Film Resistors for Measurement

Building on TDK’s 85 years of experience commercializing magnetic and electronic materials, TDK Ventures will focus its investments on technologies and solutions that leverage fundamental material science to unlock an attractive and sustainable future for the world.

These would include but not be limited to magnetics, MEMS, piezoelectrics, dielectrics, semiconductors, organic materials and neuro-electricals. TDK Ventures expects to identify and explore new ideas and technologies, fund and support promising companies and provide access to markets where TDK operates.

Innovative startups will be able to leverage TDK’s scale and reach to access potential customers, channels, a global ecosystem, industry connections, market knowledge, operating expertise as well as go-to-market/branding mentorship. In return, TDK will gain early insights into new technologies, allowing the leading global electronics company to enhance its technology roadmap and make forays into new markets and segments.

“The investments made by TDK Ventures will bring new, powerful, transformative business opportunities to TDK,” said Shigenao Ishiguro, President and Chief Executive Officer, TDK Corporation. “With TDK Ventures, TDK will continue to expand the marketplace and deliver sustainable growth into our future.”

The vision of TDK Ventures is to embrace and propel the digital and energy transformations of segments such as health and wellness, next-generation transportation, robotics and industrial, mixed reality, and the wider IoT markets. TDK plans to hire top talent with experience and investment capability related to CVC activities to collaborate with startups globally. Nicolas Sauvage, who brings more than 20 years of industry experience, will serve as Managing Director of TDK Ventures, Inc.

TDK Ventures is looking towards partnering with the right startups that meet our investment guiding principles; the development and use of fundamental material science to unlock meaningful megatrends. Interested startups may contact TDK Ventures: www.tdk-ventures.com or [email protected].

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