Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

    B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

    Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

    B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

    Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TDK EMC components and inductors: First chip beads and inductors with robust soft termination

21.3.2017
Reading Time: 2 mins read
A A

source: TDK news

TDK Corporation presents the world’s first multilayer chip beads and inductors with the innovative soft-termination technology that is already proven in TDK MLCCs. The external electrodes of the new KMZ1608 and KPZ1608 series of chip beads and the KLZ1608 and KLZ2012 series of inductors feature a conductive resin layer that offers effective protection against board flexure and solder cracks due to mechanical stress during mounting and thermal shock during operation. As a result, these soft-termination automotive-grade components offer high reliability under harsh conditions, even at high operating temperatures up to 150 °C. They are thus suitable for demanding automotive applications, such as engine control modules (ECMs) and various in-vehicle electronic control units (ECUs), and advanced driver assistance systems (ADAS), as well as in a variety of industrial equipment.

RelatedPosts

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

The demand for compact, lightweight and robust multilayer inductive components is steadily growing as the electronic functionality of vehicles continues to increase and as more and more ECUs are positioned closer to the engine. The new KMZ1608 and KPZ1608 series of chip beads are available in IEC 1608 case size with dimensions of 1.6 mm x 0.8 mm x 0.8 mm. The KLZ1608 and KLZ2012 series are available in IEC 1608 and 2012 case sizes and measure in at 1.6 mm x 0.8 mm x 0.8 mm and 2.0 mm x 1.25 mm x 1.25 mm, respectively. The lineup of multilayer chip beads and inductors with soft terminations will be continuously expanded to include smaller case sizes. Volume production of the AEC-Q200 qualified products began in March 2017.

Glossary

Soft termination: The terminal electrode of standard products consists of three layers: copper (Cu), nickel (Ni), and tin (Sn) on the base electrode of Ag. The terminal electrode of soft-termination components consists of two layers: Ni and Sn bonded to the Ag base electrode with an elastic resin.

Main applications

  • Engine control modules (ECM) and various in-vehicle electronic control units (ECU)
  • Advanced driver assistance systems (ADAS)
  • Industrial equipment

Main features and benefits

  • Effective protection against board flexure and solder cracks
  • Suitable for high operating temperatures up to 150 °C

Key data

Chip beads
Series Impedance [Ω]
@ 100 MHz, ±25%
DC resistance
[Ω] max.
Rated current [mA] max.
-55 to +125 °C +125 to +150 °C
KMZ1608
(signal lines)
50 to 2500 0.1 to 0.8 200 to 800 100 to 400
-55 to +85 °C +125 °C +150 °C
KPZ1608
(power lines)
30 to 1000 0.015 to 0.3 800 to 5000 500 to 2000 300 to 1000

 

Inductors
Series Inductance
[µH] ±20%
DC resistance
[Ω] ±30%
Rated current [mA] max.
KLZ1608 1.0 to 22 0.15 to 2.4 55 to 190
KLZ2012 1.0 to 100 0.10 to 3.7 30 to 700

Related

Recent Posts

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

3.9.2026
1

Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

3.9.2026
2

Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

1.9.2026
5

Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

1.9.2026
5

B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

31.8.2026
24

Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

31.8.2026
17

Filter Capacitors in Electric Vehicles: Knowles Safety MLCCs for BMS and Isolated DC/DC Converters

28.8.2026
39

YAGEO Expands Aluminum Polymer Capacitors for High-Temperature AI Server Power Rails

28.8.2026
43

Vishay IFBT SMT Flyback Transformers Target PoE and Isolated DC/DC Designs up to 30 W

28.8.2026
15

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved