Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Test Explanations: Mechanical Conditioning

14.9.2021
Reading Time: 2 mins read
A A

Mechanical conditioning are intended to assess the mechanical stability of the contact interface under field conditions. As noted previously in this chapter, disturbances of the contact interface can be driven by either thermal or mechanical forces. The thermal forces result indirectly from thermal expansion mismatch stresses, thermal cycling or thermal shock, while the mechanical forces are applied directly, mechanical shock or vibration.

The difference between thermal cycling and thermal shock is the rate of change of temperature between the upper and lower temperature limits. Thermal cycling is generally a slow change in temperature, often by cycling either the applied current or the oven temperature, while thermal shock is generally rapid by moving the samples between chambers at different temperatures. An oven suitable for thermal cycling is shown in Figure 2.116 and a dual chamber, thermal shock oven, in Figure 2.117.

RelatedPosts

Polymer Materials and Processing

What is RF Connector

Connector Materials and Processes

Fig. 2.116: Temperature life, thermal cycling oven
Fig. 2.117 : Dual chamber thermal shock oven

Thermal shock is further differentiated by the different thermal response times of the connector and system components. While the magnitude of the applied stresses may be the same for a given temperature change, the rate of application of the stresses in thermal shock is generally a more demanding environment. The thermal stresses realized are dependent on the size of the connector because the differential change in length is dependent on the length of the connector or system. This fact should be taken into consideration when selecting the samples to be tested. Table 2.7 lists typical conditions of thermal shock.

Tab. 2.7: Typical thermal shock parameters

Mechanical shock is generally intended to simulate transportation stresses, though there are some connector environments, e.g. automotive that experience mechanical shocks as a part of their application environment. The G values and number of shocks applied are application dependent.

Related

Source: Wurth elektronik

Recent Posts

Connector PCB Design Challenges

3.10.2025
48

Non-Magnetic Interconnects

23.4.2025
27

10 Tips for Ensuring Reliability of Discrete Wire Assemblies

20.2.2025
56

Polymer Materials and Processing

11.8.2025
61

Basic PCB Technology Overview

1.7.2025
24

What is RF Connector

17.12.2024
14

Creepage and Clearance of Connector

25.7.2025
24

Microwave Multi Line Connectors Mounting and Handling Precautions

11.8.2025
3

BASIC PCB Design Rules – Layout

1.7.2025
37

MEMR RF Relay for Space Compact Redundancy Ring

17.12.2024
4

Upcoming Events

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

Oct 30
11:00 - 12:00 CET

Space Ceramic Capacitors with Flexible Testing

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version