Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Understanding capacitor ESR in electrolytic capacitors

1.6.2022
Reading Time: 6 mins read
A A

Today’s microprocessor-based systems require power sources that deliver high current and ultra-fast transient performance, with tight regulation.  This creates a need for cost-effective, compact capacitors with high capacitance values. Electrolytic capacitors are the solution of choice but it’s important to go beyond specifying capacitance and voltage to consider equivalent series resistance (ESR) as a figure of merit.

ESR: Easier to define than specify

RelatedPosts

KEMET Design it Day: Capacitors and Inductors Selection Guide for Decoupling And Filtering

How to determine and measure MLCC ripple current and ESR

Degradation of ESR in Polymer Tantalum Capacitors during High Temperature Storage BEST PAPER AWARD

The capacitor equivalent circuit comprises four elements (Figure 1, right): capacitance, equivalent series inductance (ESL) – the sum of inductive elements including leads, a high-resistance DC path (Rp) in parallel with the capacitance, and equivalent series resistance (ESR) – the series resistive effects combined into a single element.

ESR is frequency-dependent, temperature-dependent, and changes as components age. It is usually only an important consideration in selecting electrolytic capacitors.

Constructing the capacitor

‘Wet’ aluminium electrolytic capacitors have an anode plate comprising an electrochemically-etched aluminium foil, a dielectric formed as an oxide layer on this foil, a paper spacer to hold conductive fluid that forms the cathode, and a second foil that connects the electrolyte and the device’s terminal.

Fluid electrolyte penetrates the pores of the oxidised anode foil, so contact area, and hence capacitance, are maximised. The electrolyte’s temperature-dependent conductivity is a major contributor to ESR. Ohmic losses produced by the aluminium oxide layer are frequency-dependent, reducing as frequency increases. Fluid electrolyte is lost over time by vaporisation and diffusion, causing a gradual reduction in the amount of conducting material, reducing the contact area, increasing the ESR and reducing capacitance.
This “drying out” process is temperature dependent and accelerates in components used at higher temperatures or subjected to higher ripple currents, which dissipate more heat as part of their circuit function.

In aluminium electrolytics, ESR falls as temperature increases – its effects reduce as assemblies warm up.

Drying out is irrelevant in solid aluminium electrolytics, or ‘hybrid’ capacitors, where a polymerised organic semiconductor material replaces liquid electrolyte. This technology exhibits a specific conductance of around 10,000 times that of a liquid electrolyte. As Figure 2 shows, overall equivalent series resistance is reduced substantially, most significantly at low temperatures.

Tantalum technology

Tantalum capacitor electrolytics have tantalum anodes of either sintered powder, or plain or etched foil. The insulator is an oxide layer on the anode surface. In foil devices the second conductor is an electrolyte held in a spacer. A deposit of manganese dioxide covers the oxide layer in solid versions.

The component’s terminations are substantial contributors to ESR. In a solid capacitor the manganese dioxide is commonly covered with carbon and then a metal such as silver, which is soldered to the negative lead or case. In the foil style, the positive connection is a welded nickel or steel wire connected to a tantalum wire on the anode. Such devices also contain a second tantalum foil in contact with the electrolyte.
At low frequencies, the oxide losses are most significant. But their contribution decreases inversely with frequency, eventually becoming small compared with the contact material resistance (Figure 3).

Figure 3: Typical relationship beween ESR and frequency for tantalum capacitors (AVX)

Why is ESR important?

Electrolytic capacitors are used as input buffers to supply energy when the mains input voltage is too low, store energy while an AC/DC converter adapts to a new power level, and prevent switching noise from the converter reaching the power source. On the output of a converter, they act as a filter and current sink for inductive elements, and, in DC/DC conversion, function as an energy buffer when the power output demand changes.

In both cases, losses due to ESR will inhibit a capacitor’s ability to quickly source or sink charge. At the input, increasing ESR increases high frequency noise across the capacitor, decreasing filtering effectiveness. At the output, higher ESR causes more ripple, influencing stability of the control loop.

ESR is particularly important in applications with low duty-cycle, high-frequency current pulses. Here, the ripple voltage due to the ESR will be greater than expected based on capacitance alone, although the negative correlation of ESR with temperature means that ripple decreases as the assembly warms up.

Also, the introduction of a resistive element into what designers may assume is a purely reactive circuit can lead to unexpected shifts in phase response, again affecting stability.

What can be done?

Some capacitors are designed specifically for low-ESR, but manufacturers of aluminium electrolytic capacitors do not specify ESR consistently. The value at 25°C and 100kHz is commonly quoted, with a formula provided to calculate the value at the operating frequency. Some suppliers specify at 120Hz; others leave the designer to calculate the figure at the frequency of interest from the dissipation factor (tan∂) and specified maximum ripple current. Furthermore, for capacitors of comparable size and CV, a device with higher capacitance and lower voltage rating will have lower ESR and ESR tends to be lower for aluminium electrolytic devices with long, thin cases because the resistance of the foil is reduced. Larger overall case sizes can cut ESR too.

Also, several smaller-value components can be used in parallel to achieve lower high-frequency ESR, at the expense of board space.

Other advances

Several manufacturers of aluminium electrolytic capacitors have been combining solid and liquid electrolytes to produce hybrid components with ultra-low ESR (low tens of milliohms), with minimal temperature variation, while increasing withstand voltage and accommodating high ripple current.

As ESR varies with external surface area tantalum capacitor manufacturers produce multi-anode devices for high-reliability markets that may point the way to developments for more mainstream applications.

But low ESR is not always the primary consideration and, in a development outside of electrolytic devices, Murata has actually increased ESR of some of its multilayer ceramic chip capacitors, in order to control unwanted resonances that can reduce the decoupling performance at peak frequencies.

Conclusion

There has never been a more diverse range of electrolytic technologies for engineers to choose from. For power applications in particular, the data printed on the component is rarely sufficient to make an informed choice. Talking to an independent specialist that can offer components from a selection of the world’s largest capacitor manufacturers is the surest and quickest route to finding the most appropriate device for any given application.

Written by Adam Chidley Avnet Abacus European Senior Product Manager

Related

Source: AVNET ABACUS

Recent Posts

Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

Exxelia Passive Components Support BepiColombo Mission

16.9.2026
5
TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

16.9.2026
3

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
36

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
36

Emerging Capacitor Markets in Fusion Energy

10.9.2026
50
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
108
TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

9.9.2026
25
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
23

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
57

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved