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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

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    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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Wk 09 Electronics Supply Chain Digest

4.3.2024
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 3-1-24.

DATAPOINT OF THE WEEK: S&P reported Eurozone Feb mfg PMI of 46.5 vs 46.6 in January.

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Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 33 Electronics Supply Chain Digest

Despite the downtick, S&P cited tentative signs of recovery in the area with new orders and purchasing activity dropping at the smallest pace since March 2023 and outlook for the remainder of the year remaining on par with January’s nine month high.

Recovery signs, however, are less prevalent in Germany where S&P PMI slipped to 42.5 from 45.5 in January reflecting quickening in output and new order declines.

China official mfg PMI edged lower to 49.1 in Feb from 49.2 in January while the private China Caixin mfg PMI rose to 50.9 from 50.8 in Jan. In the US, ISM mfg PMI slipped to 47.8 from 49.1 in January, marking the 16th straight month of PMI below 50 reflecting renewed decline in new orders, after a rebound in Jan, and a drop in employment implying cautiousness in the outlook. In a stark contrast, S&P reported US Feb PMI improved to 52.2 vs 50.7 in January reflecting renewed rise in output and strengthening in new orders.

Headlines:

Auto

  • Aston Martin delays first EV to 2026 due to lack of demand
  • Apple cancels its decade-long electric car project
  • Italian government reached out to BYD about setting a car plant in the country
  • BYD looking for Mexico plant location, executive says
  • BYD ramps up China EV price war with bigger discounts on newest car models
  • BYD deliveries in Feb dropped 37% Y/Y and 39% M/M primarily due to Chinese New Year shutdowns
  • China retail sales including NEV declined 22% Y/Y in Feb but YTD sales up 38% reflecting ongoing strength
  • Fisker EV startup running out of cash, warning it may not continue as a going concern
  • Nissan aims to start driverless ride service in Japan by 2027
  • Hyundai launches initiative to boost procurement of domestic semiconductors
  • Valeo cuts its 2025 sales forecast citing slower demand, particularly in EVs
  • Toyota output rose 7% in January; sales up 11% Y/Y on strength in the US
  • Tesla raises prices of some Model Y vehicles in US
  • Tesla increases incentives in China following renewed price aggression in the market
  • Automakers question feasibility of California 2035 EV sales mandate
  • Volkswagen, Xpeng say first jointly made car will be electric SUV
  • Volkswagen expects sales growth to slow in 2024 amid muted economic outlook and intense competition

Datacenter 

  • Global server shipments projected to grow 2% with AI units up 12% according to TrendForce
  • Dell cites 40% increase in AI orders Q/Q; forecasts high teens increase in 2024 infrastructure hardware sales
  • HPE cuts its full year outlook citing slowdown in networking demand and tight Nvidia GPU supply

Semiconductors

  • ASML reaches ‘first light’ milestone on first High NA EUV tool
  • Applied Materials receives new subpoenas on China shipments
  • Broadcom sells remote-access unit to KKR for $4 billion
  • Intel plans sell 100 million AI CPU for PCs by 2025
  • Infineon announces restructuring of sales and marketing
  • Micron and Samsung announced production of HMB3E memory for AI applications
  • Intel, TSMC and Samsung seeking $70B in US Federal Subsidies
  • Renesas terminates agreement to acquire Sequans Communications
  • Vishay announced CFO transition
  • TSMC to start Germany fab construction in 2H24
  • Texas Instruments has laid off a chip design team for low power analog chips in Beijing

Other

  • Apple resellers in China offering steep iPhone discount in response to weak demand
  • HP Inc missed 1Q expectations on weak PC demand

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Source: Edgewater Research

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