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Wk 43 Electronics Supply Chain Digest

28.10.2024
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 10-25-24.

DATAPOINT OF THE WEEK: S&P reported US Oct mfg flash PMI of 47.8 vs 47.3 in Sep reflecting a continued decline in output and new orders, albeit at a moderating pace compared to Sep. 

RelatedPosts

July 2025 Interconnect, Passives and Electromechanical Components Market Insights

Wk 29 Electronics Supply Chain Digest

June 2025 ECST Components Survey Delivers Stunning Results

S&P noted inventory of finished goods rose for the fourth consecutive month keeping the forward-looking order-to-inventory ratio at one of the lowest levels seen since the global financial crisis, signaling continued production weakness near term.

S&P reported Eurozone Oct flash mfg PMI of 45.9 vs 45.0 in Sep reflecting a continued notable decline in activity, albeit at a moderating pace M/M. S&P noted employment in Europe’s mfg sector declined for the third month running and business confidence dropped for the fifth consecutive month to the lowest of the year.

Headlines:

Auto

  • China’s CATL unveils new battery for extended-range hybrids
  • China asks carmakers to halt Europe expansion over tariff spat
  • China’s auto sector profit drops below 5%: CR Micro chief warns against reckless expansion
  • China xEV retail sales remain strong, projected up 2% M/M in October says CPCA
  • EU, China agree to more talks on potential alternatives to EV tariffs
  • Europe new car sales better-than-feared in September with jump in BEV sales in France and UK
  • GM tops sales and profit estimates amid resilient demand for large SUVs and trucks
  • GM Sees EV squeeze as Canada swaps subsidies for deadlines
  • Mercedes pledges cost cuts after China slump hits margin
  • ZF to quit Wolfspeed’s German chip project says Reuters
  • Tesla CEO Elon Musk projects 20-30% vehicle unit growth in 2025
  • Volvo cuts 2025 sales growth forecast to 7-8% from 12-15% back in July
  • US new Auto SAAR forecasted stable at 15.8M in Oct

IP&E

  • Amphenol reported 26% Y/Y increase in 3Q revenue driven by strength in IT datacom and Mobile Devices

Industrial

  • Boeing workers reject the latest offer, leaving Boeing factories idle

Semiconductors

  • Arm to scrap Qualcomm chip design license in feud escalation
  • US extends 25% chip tax credit to wafers, including solar
  • Intel reiterates commitment to invest $28B in two fabs in Ohio
  • Intel seeks foundry alliance with Samsung foundry
  • Intel seeking to sell a stake in Altera
  • Mature process capacity to grow 6% in 2025; Chinese foundries lead expansion, says TrendForce
  • TSMC halts chip supply to customer after finding it in Huawei product
  • TSMC’s Arizona fab yields have surpassed Taiwan’s
  • TSMC to hike sub-5nm prices by 8-10% in 2025
  • SK Hynix sees no signs of HBM oversupply as profit soars to record
  • SiC substrate price correction may continue in 2025, says GCCS
  • Nvidia’s design flaw with Blackwell AI chips now fixed, CEO says
  • TXN beat 3Q expectations but guides below as end market trends remain mixed with softness continuing in Industrial
  • TI adds 200mm GaN power semiconductor production in Japan, quadrupling internal capacity
  • Qualcomm, Alphabet team up for automotive AI
  • Wafer shipments to remain soft in 2024 before strong rebound in 2025 says SEMI

Other

  • Apple’s Q3 China smartphone sales slip, Huawei’s soar says IDC

Related

Source: Edgewater Research

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