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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

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Wk 43 Electronics Supply Chain Digest

28.10.2024
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 10-25-24.

DATAPOINT OF THE WEEK: S&P reported US Oct mfg flash PMI of 47.8 vs 47.3 in Sep reflecting a continued decline in output and new orders, albeit at a moderating pace compared to Sep. 

RelatedPosts

Wk 45 Electronics Supply Chain Digest

Wk 44 Electronics Supply Chain Digest

IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

S&P noted inventory of finished goods rose for the fourth consecutive month keeping the forward-looking order-to-inventory ratio at one of the lowest levels seen since the global financial crisis, signaling continued production weakness near term.

S&P reported Eurozone Oct flash mfg PMI of 45.9 vs 45.0 in Sep reflecting a continued notable decline in activity, albeit at a moderating pace M/M. S&P noted employment in Europe’s mfg sector declined for the third month running and business confidence dropped for the fifth consecutive month to the lowest of the year.

Headlines:

Auto

  • China’s CATL unveils new battery for extended-range hybrids
  • China asks carmakers to halt Europe expansion over tariff spat
  • China’s auto sector profit drops below 5%: CR Micro chief warns against reckless expansion
  • China xEV retail sales remain strong, projected up 2% M/M in October says CPCA
  • EU, China agree to more talks on potential alternatives to EV tariffs
  • Europe new car sales better-than-feared in September with jump in BEV sales in France and UK
  • GM tops sales and profit estimates amid resilient demand for large SUVs and trucks
  • GM Sees EV squeeze as Canada swaps subsidies for deadlines
  • Mercedes pledges cost cuts after China slump hits margin
  • ZF to quit Wolfspeed’s German chip project says Reuters
  • Tesla CEO Elon Musk projects 20-30% vehicle unit growth in 2025
  • Volvo cuts 2025 sales growth forecast to 7-8% from 12-15% back in July
  • US new Auto SAAR forecasted stable at 15.8M in Oct

IP&E

  • Amphenol reported 26% Y/Y increase in 3Q revenue driven by strength in IT datacom and Mobile Devices

Industrial

  • Boeing workers reject the latest offer, leaving Boeing factories idle

Semiconductors

  • Arm to scrap Qualcomm chip design license in feud escalation
  • US extends 25% chip tax credit to wafers, including solar
  • Intel reiterates commitment to invest $28B in two fabs in Ohio
  • Intel seeks foundry alliance with Samsung foundry
  • Intel seeking to sell a stake in Altera
  • Mature process capacity to grow 6% in 2025; Chinese foundries lead expansion, says TrendForce
  • TSMC halts chip supply to customer after finding it in Huawei product
  • TSMC’s Arizona fab yields have surpassed Taiwan’s
  • TSMC to hike sub-5nm prices by 8-10% in 2025
  • SK Hynix sees no signs of HBM oversupply as profit soars to record
  • SiC substrate price correction may continue in 2025, says GCCS
  • Nvidia’s design flaw with Blackwell AI chips now fixed, CEO says
  • TXN beat 3Q expectations but guides below as end market trends remain mixed with softness continuing in Industrial
  • TI adds 200mm GaN power semiconductor production in Japan, quadrupling internal capacity
  • Qualcomm, Alphabet team up for automotive AI
  • Wafer shipments to remain soft in 2024 before strong rebound in 2025 says SEMI

Other

  • Apple’s Q3 China smartphone sales slip, Huawei’s soar says IDC

Related

Source: Edgewater Research

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