Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

    Panasonic Industry to Double Production of MEGTRON PCB Materials

    5th PCNS Awards Outstanding Passive Component Papers

    TDK Releases Ultra-small PFC Capacitors

    KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

    Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

    Panasonic Industry to Double Production of MEGTRON PCB Materials

    5th PCNS Awards Outstanding Passive Component Papers

    TDK Releases Ultra-small PFC Capacitors

    KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

    Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

X-FAB Provides Foundry Service for Passive Device Integration

19.9.2023
Reading Time: 3 mins read
A A

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has further added to its broad proficiency in RF by announcing new integrated passive device (IPD) fabrication capabilities using its XIPD process.

XIPD is derived from the popular X-FAB XR013 130nm RF SOI process and leverages an engineered substrate along with a thick copper metallization layer. The technology enables customers to integrate passive elements (inductors, capacitors and resistors) directly into their device designs, resulting in significant space and cost savings. Fabrication is undertaken at X-FAB’s facility in Corbeil-Essonnes, France, capitalizing on the company’s extensive experience in copper metallization.

RelatedPosts

Exxelia Exhibit at Electronica India September 17–19, 2025

Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

The ongoing roll-out of 5G cellular infrastructure along with the development of 6G communications and the emergence of the latest generation of radar and satellite communications technology, have meant that devices are needed that exhibit wider frequency support. Through use of the XIPD platform, demands for more compact RF/EMI filtering, matching networks, baluns and couplers can be met – via the fabrication of fully integrated high-quality passive components with improved performance characteristics. 

Instead of having to rely on the use of surface-mount or discrete passive components, which can prove inconvenient due to component deviation at high frequency or increased component sourcing complexity, XIPD enables a much more effective route that streamlines overall system design, accelerates development cycles, simplifies manufacturing and curbs the engineering expenses involved. Operation across an extensive frequency range, from the sub-6GHz band all the way to the high-end of the mmW band, can be accommodated.  

X-FAB is unique in offering a European-based foundry service for any-size-volume integrated passive production. A comprehensive process design kit (PDK) is available. This supports both the Cadence and Keysight ADS design environments, enabling customers to make accurate simulations and achieve first-time-right design of the complete RF sub-system. Initial prototyping with several key customers has now commenced.  

“Though RF semiconductor devices continue to shrink, the passive components that accompany them still remain relatively large. This mismatch doesn’t fit well with the need for sleeker electronic equipment, causing excess board area to be taken up,” Rudi De Winter, CEO of X-FAB, notes; “By adopting our XIPD technology, not only is it possible to achieve space savings of multiple orders of magnitude, but it also translates into reductions in the associated costs too. This has the potential to be a real game-changer for our customer base, permitting the co-packaging of active and passive dies together, while achieving high yields.”     

X-FAB’s RF Technology Director, Greg U’Ren, adds: “Furthermore, current acoustic-based technology solutions for filtering are not capable of mmW frequency operation and satisfying next-generation communication standards. Our XIPD solution adds value to the market by enabling our customers to realize compact RF system designs, minimizing losses through incorporation of fully integrated hardware. We are already working on projects needing 70-80GHz operation, which would be unthinkable using a discrete passive arrangement.”

Acronyms
ADS – Advanced Design System
EMI – Electromagnetic Interference
IPD – Integrated Passive Device
PDK – Process Design Kit
RF – Radio Frequency
SOI – Silicon-on-Insulator 

About X-FAB 
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special silicon carbide and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,200 people worldwide. Learn more at xfab.com.

Related

Source: X-FAB

Recent Posts

Exxelia Exhibit at Electronica India September 17–19, 2025

15.9.2025
8

Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

15.9.2025
2

VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

15.9.2025
4

SCHURTER Releases High Performance EV-Fuse

15.9.2025
3

Panasonic Industry to Double Production of MEGTRON PCB Materials

15.9.2025
0

5th PCNS Awards Outstanding Passive Component Papers

14.9.2025
16

TDK Releases Ultra-small PFC Capacitors

10.9.2025
27

KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

10.9.2025
24

Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

10.9.2025
16

TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

5.9.2025
30

Upcoming Events

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version