Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2025 ECIA US Components Sales Sentiment Remains Strong

    Vishay Releases Industry First Automotive SMD Y1 Safety Ceramic Capacitors

    Researchers Enhanced 2D Ferromagnets Performance

    Bourns Releases Two High Current Common Mode Choke Models

    Electronics Weekly Announcing Finalists for Elektra Awards 2025

    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2025 ECIA US Components Sales Sentiment Remains Strong

    Vishay Releases Industry First Automotive SMD Y1 Safety Ceramic Capacitors

    Researchers Enhanced 2D Ferromagnets Performance

    Bourns Releases Two High Current Common Mode Choke Models

    Electronics Weekly Announcing Finalists for Elektra Awards 2025

    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

4DS Memristors Target ReRAMs

27.7.2017
Reading Time: 3 mins read
A A

source: EETimes article

published October 24th 2016, updated July 24th 2017

RelatedPosts

August 2025 ECIA US Components Sales Sentiment Remains Strong

Vishay Releases Industry First Automotive SMD Y1 Safety Ceramic Capacitors

Researchers Enhanced 2D Ferromagnets Performance

LAKE WALES, Fla. — 4DS Memories Ltd. (West Perth, Western Australia) claims to have achieved 40-nanometer resistive random-access memories (ReRAMs) that are denser than flash and rival the recently reported Crossbar Inc.’s (San Francisco) ReRAM licensed to China.

“Crossbar only states that they are using 40nm design rules without disclosing the cell size which means that we can only guess that the linear dimension of the cell size is a multiple of 40nm. It is more important to realize that Crossbar is a filamentary ReRAM technology that is difficult to scale to small geometries,” Guido Amout, CEO and managing director of 4DS, told EE Times.

4DS claims its 40-nanometer ReRAM is a first, but many other labs besides 4DS and Crossbar are known for serious ReRAM efforts using memristors including Adesto Technologies, Elpida, Fujitsu, Global Foundries, Hewlett Packard, Hynix, IBM, Macronix, Nanya, NEC, Panasonic, Rambus, SanDisk, Samsung, Sharp, Sony, ST Microelectronics, Winbond, and several research-only labs like Imec collaborating with foundry partners like TSMC.

Flash is reaching the end of its ability to scale linearly, prompting the move to 3D, such as Samsung’s, Toshiba’s and Western Digital’s recent demonstrations of 64-layer stacked-die flash memories.

The bit-cell stack controls its resistance by the migration of oxygen ions between the opposing metal electrodes. (Source: 4DS)

Fig 1. The bit-cell stack controls its resistance by the migration of oxygen ions between the opposing metal electrodes.
(Source*: TMT Analytics. The report with the diagram can be found here: http://www.tmt-analytics.com.au/4ds-memory.html ) 

4DS, on the other hand, claims to be one-upping 3D flash by collaborating with Hitachi Global Storage Technologies (HGST is a Western Digital subsidiary) for the last two years. Together they pioneered a better-than-flash Interface Switching ReRAM using a non-filamentary technology with perovskites and migrating oxygen ions to economically give mobile clouds gigabyte storage capabilities. The HGST joint development agreement was renewed in July 2016 for another year in order to optimize its ReRAM’s scalability and cycling endurance, according to 4DS.

4DS's target market for its resistive random access memories (ReRAMs) is non-volatile cloud market with aims to give nearly instant access to mobile devices. (Source: 4DS)

Fig.2. 4DS’s target market for its resistive random access memories (ReRAMs) is non-volatile cloud market with aims to give nearly instant access to mobile devices. (Source: 4DS) 
4DS also claims to have invested only $12 million to research and develop its recent demonstration chips. The demo chips, 4DS claims, prove its ReRAM memory cells are faster, cheaper and lower power than 3-D flash, giving the company hope at carving out a segment of the $40 billion global market for flash.

For more information, read 4DS’s white paper Next-gen Cloud and DC storage technology.

— R. Colin Johnson, Advanced Technology Editor, EE Times

* the source of Fig 1 was originally mentioned EE Times and 4DS. However the original source is TMT Analytics, EPCI apologise for incorrect reference. 

Related

Recent Posts

Researchers Enhanced 2D Ferromagnets Performance

16.9.2025
5

DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

27.8.2025
12

Researchers Demonstrated HfO Anti-Ferroelectric Flexible Capacitors

19.8.2025
20

Additive Manufacturing of Mn-Zn Ferrite Planar Inductors

4.8.2025
36

Researchers Presents High-Performance Carbon-Based Supercapacitors

1.8.2025
40

Würth Elektronik Expands MagI³C with Variable Step-Down Modules

30.7.2025
33

Switched Capacitor Converter Explained

28.7.2025
87

Researchers Demonstrated 200C Polymer Film Dielectric

28.7.2025
24

Researchers Demonstrated Zinc-Ion Based Photo-Supercapacitor

28.7.2025
20
Comparative display of a grain size and domain structure; b free energy; c P-E loops after high-entropy ceramics (HECs) and PGS design. source: Nature Communications  ISSN 2041-1723

Researchers Propose Novel MLCC Dielectric Design to Increase Energy Storage Capacity

24.7.2025
68

Upcoming Events

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version