Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Image credit: Samtec

    How to Match the Right Connector with Protocol Requirements

    Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Image credit: Samtec

    How to Match the Right Connector with Protocol Requirements

    Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Bourns Announces Three-pin Current Sense Resistors to Reduce Sensing Errors

7.10.2022
Reading Time: 3 mins read
A A

Bourns is pleased to announce the extension of the model CSM2F series AEC-Q200 compliant current sense resistor families with additional sensing pins which connect to the customer’s PCB by through-hole soldering. The three-pin current sense resistors designs aims to reduce the sensing error.

Current sense resistors are growing in popularity due to their high measurement accuracy and relatively low cost compared to other technologies. This new product series complements Bourns’ other circuit conditioning components, such as power inductors and rectifier diodes.

RelatedPosts

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

These new models come with either two or three tin-plated copper pins. Two pins are riveted to the voltage test points of the shunt resistor in order to measure the voltage drop on the resistive element, which is proportional to the current flow through the resistor.

The optional third pin connects to the ground side of the circuit. For two-pin designs, the current used by the sensor device flows through the ground side pin and causes a voltage drop between the PCB connection and the resistor, which can result in a sensing error. Three-pin designs reduce the sensing error by carrying the ground current on a separate path from the sensing circuit.

Principle of two and three termination pin current sense shunt resistors; source: Bourns

Bourns® CSM2F Series Current Sense Resistors are manufactured using electron beam welded resistive and copper alloys. This product family is available with three different surface finishes.

  • The “Pre-Plated” copper terminal version is tin-plated before the electron beam welding process. The top and bottom surface of the copper terminals are plated while the side terminals and the resistive element remain non-plated due to the stamping process.
  • The “Fully-Plated” version goes through the tin-plating process after material stamping to ensure the resistive element and all side terminals are covered by tin. This process enhances the performance of the Model CSM2F Series with better long-term stability and lower resistance drift.
  • The “Bare-Copper” version is without tin-plating and provides better TCR (Temperature Coefficient of Resistance) performance.

The Bourns® Model CSM2F Series is available in four different footprint sizes: 6918, 8518, 7036, and the new 8536 metric. The series features resistance values ranging from as low as 25 µΩ up to 200 µΩ, with permanent power ratings of up to 50 watts, continuous current up to 1414 amps and the ability to handle high pulse power ratings. The metal alloy current sensing element enables thermal EMF as low as 0.25 µV/K and low TCRs of ±50 PPM/°C in the 20 °C to 60 °C temperature range.

Features

  • EB welded metal strip
  • Passivated bare copper, plated top and bottom surface or fully-plated terminals
  • Two sensing pins for voltage sensing
  • Optional third sensing pin for ground connection
  • Up to 50 W permanent power
  • Excellent long-term stability
  • Low resistance, low TCR
  • Low thermal EMF
  • Maximum fastening torque: 10 Nm
  • Bulk or tray packaging
  • RoHS compliant*
  • Automotive AEC-Q200 compliant

Applications

  • Battery Management Systems (BMS)
  • Current sensing for hybrid and electric vehicles
  • Current sensing in bus bars
  • Current sensing in welding equipment
  • Voltage division
  • Power modules
  • Frequency converters
  • Industrial

Related

Source: Bourns

Recent Posts

Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

6.11.2025
8

Capacitor Lead Times: October 2025

6.11.2025
54

Coilcraft Introduces Ultra-Low Loss Shielded Power Inductors

6.11.2025
13

Würth Elektronik Expands its MagI³C-VDMM MicroModules

5.11.2025
10

Littelfuse Releases Load-Powered Compact Relay

5.11.2025
13

Murata Expands High Cutoff Frequency Chip Common Mode Chokes

5.11.2025
9

Samtec Expands Offering of Slim, High-Density HD Array Connectors

30.10.2025
10

Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

30.10.2025
24

Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

30.10.2025
42

Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

27.10.2025
33

Upcoming Events

Nov 11
17:00 - 18:00 CET

Industrial Applications Demand More from Interconnects in Next-Gen Designs

Nov 12
11:00 - 12:00 CET

PCB Design: Impedance is for everyone!

Nov 12
November 12 @ 12:00 - November 13 @ 14:15 EST

Microelectronic Packaging Failure Modes and Analysis

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version