source: ASRC Federal Space and Defense (NASA,USA), EPCI e-Symposium Abstract: Insertion of COTS components into hi-rel systems require extensive environmental...
Read moreDetailssource: ESA, EPCI e-Symposium Abstract: The presented presentation slides are prepared based on ESA long term experience with passive components...
Read moreDetailssource: Serma Technologies, EPCI e-Symposium Abstract: SERMA TECHNOLOGIES is presenting failure statistics of all return parts analyzed during the last...
Read moreDetailsSource: Power Electronics news Bill Schweber | Oct 12, 2017, For both active and passive devices, the negative of effects...
Read moreDetailssource: Semiconductor Engineering news October 9th, 2017 - By: Jeff Dorsch. IPDs take the place of discretes for mobile, IoT, wearables,...
Read moreDetailssource: RF Global net news Modelithics has released The COMPLETE Library v17.2 for Keysight Genesys, with 48 new models for...
Read moreDetailssource: D.Zogbi for TTI Market Eye article A current detailed analysis of the thick film chip resistor supply chain from...
Read moreDetailssource: Stackpole news Stackpole Electronics, Inc. announces the release of the UHV series of ultra-high voltage chip resistors. Resistance values...
Read moreDetailssource: AVX Corporation, EPCI e-Symposium Abstract: In common with commercial applications, demand for established reliability solutions with higher bulk capacitance...
Read moreDetailssource: SCHURTER AG, EPCI e-Symposium Abstract: The aim of this article is to outline the differences between the high reliable...
Read moreDetails© EPCI - Leading Passive Components Educational and Information Site
© EPCI - Leading Passive Components Educational and Information Site