source: prweb news Cornell Dubilier Electronics, Inc. (CDE) has introduced the latest in its series of Flatpack ruggedized flat aluminum...
Read moreDetailssource: TDK application note Recently released TDK application note compare chip capacitor and chip varistor ESD performance. Electrostatic Countermeasure By...
Read moreDetailssource: EPCI, EPCI e-Symposium Abstract: The paper has been written specifically for the ESA 2nd SPCD symposium with a target...
Read moreDetailssource: EDN article The "GaN revolution" may re-define a whole component market and passive components selection guidelines. Have a look...
Read moreDetailssource: Murata news updated October 18, 2016 – Murata Manufacturing Co., Ltd., (“Murata”) today announced that Murata Electronics Europe B.V.,...
Read moreDetailssource: NewsMaker news Vacuum Capacitors Market report 2016-2020 focuses on the major drivers and restraints for the key players. Vacuum...
Read moreDetailsDr. Alexander Teverovsky from Goddar Space Flight Center agreed to answer some EPCI questions on the evaluation of passive components...
Read moreDetailssource: TDK article TDK has been offering pouch-type EDLCs, and has developed a new ultra-thin EDLC, with a thickness of...
Read moreDetailssource: PR.com news Scientists from London based UltraCap Ltd., are in the final stages of developing a "green" solid state...
Read moreDetailssource: Taiyo Yuden news TOKYO, September 27, 2016 TAIYO YUDEN CO., LTD. announced today the commercialization of the low-profile multilayer...
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