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Würth Elektronik Releases Long Life SMT nano and microSD Card Connectors

Glass Core Technology Breakthrough Potential for High-Speed Interconnects

YAGEO Releases High Isolation Transformer for 1500VDC Applications

Bourns Releases 1500VDC Power Fuse for Photovoltaic Applications

Murata Releases Worlds First Molded Thermistor with Wire-Bonding

Vishay Extends Axial Wirewound Resistors with WSZ Lead Form

Smoltek CNF-MIM Capacitor Commercialization Update

Bourns Unveils Automotive Thick Film on Steel

TT Electronics Releases Failsafe and High Surge SMD MELF Resistors
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inter-connect news

Würth Elektronik Releases Long Life SMT nano and microSD Card Connectors

12.6.2025

News

H.C. Starck launches tantalum and niobium metal powder range for additive manufacturing

9.11.2019

Source: 3D Printing Industry article H.C. Starck Tantalum and Niobium, a metal powder manufacturer based in Germany, has announced the...

17.10.2019

Source: Ohmcraft; EIN Presswire news ROCHESTER, N.Y., UNITED STATES, -- The prospect of life beyond Earth has fascinated scientists for decades....

17.10.2019

Source: Vishay news Vishay intertechnology introduces three new automotive grade IHLP® inductors in its smallest 1212 case size for under...

15.10.2019

Source: TDK news TDK Corporation has extended the portfolio of EPCOS film capacitors for DC link applications with the B3277*X/Y/Z...

5.12.2019

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Source: Kemet Application Intelligence Center video Kemet Application Intelligence Center released a video with practical example of how MLCC ceramic...

15.10.2019

Source: SMP news Graben-Neudorf, Germany, October 2019. SMP has developed "All Mode" EMC filters with high frequency stability. The High...

10.12.2019

The KOA RN73H and RN73R are thin film resistors designed for high reliability in industrial, medical, transportation, and other high...

24.8.2022

One of the most common uses of capacitors is decoupling. It is used for regulated supplies to maintain a constant...

13.10.2019

Source: Business Wire news 2019 Heterogeneous Integration Roadmap (HIR) released by IEEE identifies long-term technology requirements to inspire collaboration in...