Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Top 10 Connector Vendors by Product Type

    Bourns Releases High‑Q Air Coil Inductors for RF Aplications

    CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

    ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

    Würth Elektronik Offers Halogen‑Free EMC Gaskets for Displays and Housings

    Component Distribution Supply Chain January 2026

    Binder Unveils M8 Flange Solder Connectors for Flexible Cabling

    Power Electronics Tools for Passives and Magnetic Designs

    Modelithics Releases Component Model Library for SIMULIA CST Studio Suite

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Top 10 Connector Vendors by Product Type

    Bourns Releases High‑Q Air Coil Inductors for RF Aplications

    CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

    ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

    Würth Elektronik Offers Halogen‑Free EMC Gaskets for Displays and Housings

    Component Distribution Supply Chain January 2026

    Binder Unveils M8 Flange Solder Connectors for Flexible Cabling

    Power Electronics Tools for Passives and Magnetic Designs

    Modelithics Releases Component Model Library for SIMULIA CST Studio Suite

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Development of Atomically Thin Magnets Enable Next Generation of Thinner and Faster Electronics

14.5.2020
Reading Time: 3 mins read
A A
A ferromagnetic semiconductor semiconductor two-atoms thick. The green, blue, and red spheres are sulfur, molybdenum and iron atoms, respectively.
Credit: Stevens Institute of Technology

A ferromagnetic semiconductor semiconductor two-atoms thick. The green, blue, and red spheres are sulfur, molybdenum and iron atoms, respectively. Credit: Stevens Institute of Technology

Stevens researchers develop a ferromagnetic semiconductor that works at room temperature, solving one of science’s most intractable problems

As our smartphones, laptops, and computers get smaller and faster, so do the transistors inside them that control the flow of electricity and store information. But traditional transistors can only shrink so much. Now, researchers at Stevens Institute of Technology have developed a new atomically thin magnetic semiconductor that will allow the development of new transistors that work in a completely different way; they not only can harness an electron’s charge but also the power of its spin, providing an alternative path to creating ever smaller and faster electronics.

RelatedPosts

Top 10 Connector Vendors by Product Type

Bourns Releases High‑Q Air Coil Inductors for RF Aplications

CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

Rather than relying on making smaller and smaller electrical components, the new discovery, reported in the April 2020 issue of Nature Communications, potentially provides a critical platform for advancing the field of spintronics (spin + electronics), a fundamentally new way to operate electronics and a much-needed alternative to continued miniaturization of standard electronic devices. In addition to removing the miniaturization barrier, the new atomically thin magnet can also enable faster processing speed, less energy consumption and increased storage capacity.

“A two-dimensional ferromagnetic semiconductor is a material in which ferromagnetism and semiconducting properties coexist in one, and since our material works at room temperature, it allows us to readily integrate it with the well-established semiconductor technology,” said EH Yang, a professor of mechanical engineering at Stevens Institute of Technology, who led this project.

“The magnetic field strength in this material is 0.5 mT; while such weak magnetic field strength cannot allow us to pick up a paper clip, it is large enough to alter the spin of electrons, which can be utilized for quantum bits applications,” said Stefan Strauf, a professor of physics at Stevens.

When computers were first built, they filled an entire room, but now they can fit in your back pocket. The reason for this is Moore’s law, which suggests that every two years, the number of transistors that fit on a computer chip will double, effectively doubling a gadget’s speed and capability. But transistors can only become so small before the electrical signals that they are supposed to control no longer obey their commands.

While most forecasters expect Moore’s law will end by 2025, alternative approaches, which do not rely on physical scaling, have been investigated. Manipulating the spin of electrons, instead of relying solely on their charge, may provide a solution in the future.

Building a new magnetic semiconductor using two-dimensional materials – that is, two-atoms thick- will allow the development of a transistor to control electricity with control of the spin of an electron, either up or down, while the whole device remains lightweight, flexible and transparent.

Using a method called in situ substitutional doping, Yang and his team successfully synthesized a magnetic semiconductor whereby a molybdenum disulfide crystal is substitutionally doped with isolated iron atoms. During this process, the iron atoms kick off some of the molybdenum atoms and take their place, in the exact spot, creating a transparent and flexible magnetic material – again, only two-atoms thick. The material is found to remain magnetized at room temperature, and since it is a semiconductor, it can directly be integrated into the existing architecture of electronic devices in the future.

Yang and his team at Stevens worked with several institutions to image the material – atom by atom – to prove that the iron atoms took the place of some of the molybdenum atoms. These institutions included the University of Rochester, Rensselaer Polytechnic Institute, Brookhaven National Laboratory, and Columbia University.

“To do something great in science, you need to get others to collaborate with you,” said Shichen Fu, a Ph.D. student in mechanical engineering at Stevens. “This time, we brought all the right people together – labs with different strengths and different perspectives – to make this happen.”

Related

Source: EurekAlert

Recent Posts

Bourns Releases High‑Q Air Coil Inductors for RF Aplications

29.1.2026
19

CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

28.1.2026
30

ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

28.1.2026
23

Würth Elektronik Developed a Custom Transformer for Active Hand Orthosis

26.1.2026
38

Passive Components in Quantum Computing

22.1.2026
125

Exxelia Offers Custom Naval Transformers and Inductors

21.1.2026
16

Researchers Demonstrated 32nm Aluminum Vacuum Gap Capacitor

20.1.2026
41

Würth Elektronik Introduces Product Navigator for Passive Components

14.1.2026
89

Panasonic Passive Components for Reliable Robotic Arms

14.1.2026
115

Upcoming Events

Feb 24
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • How Metal Prices Are Driving Passive Component Price Hikes

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Degradation of Capacitors and its Failure Mechanisms

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version