Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Exxelia Releases High Performance Busbars for Power Electronics

23.12.2024
Reading Time: 4 mins read
A A

Exxelia SVM Private Limited is proud to offer a comprehensive range of bus bars tailored to the demanding requirements of power electronics applications.

Whether it’s laminated, molded, or insulated bus bars with resin or powder coatings bus bars, each solution is meticulously designed for optimal performance.

RelatedPosts

Exxelia Passive Components Support BepiColombo Mission

Exxelia Offers 1200V Capacitors and Magnetics for 800V Aerospace Platforms

HEICO’s Exxelia Expands High-Voltage Ceramic Capacitor Portfolio with CalRamic Acquisition

Multilayer laminate busbars are key components in modern power distribution systems. These precision-manufactured conductors combine efficient power handling with integrated safety features through their laminated construction. The design allows for customized current capacity and voltage isolation requirements while maintaining compact dimensions.

Exxelia SVM’s Custom-Engineered Configurations

  • Single conductor laminated designs for straightforward applications
  • Multiple conductor single lamination systems for enhanced power distribution
  • Advanced 2, 3 or 4 layer configurations for complex power requirements
  • Custom-engineered assembly solutions for specific needs

Premium Materials for Superior Performance


Conductor Technology

  • Premium ETP copper (99.9% pure) for maximum conductivity
  • Optional tin plating for enhanced corrosion resistance and contact efficiency
  • CNC-precision manufacturing for exact specifications

Insulation Systems

  • High-performance Bus bond (SHELDAHL) adhesive-coated PET films (3.5-14 Mils)
  • Single and double-sided adhesive options available
  • FR4/G10 glass laminate interlayer insulation (0.3-2mm)
  • UL 94 V-0 rated flame-resistant glass insulation

Professional-Grade Hardware

  • Premium stainless steel, phosphor bronze, and steel components
  • Sourced from PEM Engineering and other industry-leading manufacturers
  • Engineered for durability and reliable performance

Manufacturing Process

The manufacturing workflow incorporates several precision-controlled steps:

  • CNC-machined cutting of conductor and insulation materials to specified tolerances
  • Controlled lamination process with specified pressure and temperature parameters
  • Conductor embossing for fastener and standoff integration, with placement accuracy to ±0.1mm
  • Insulation thickness calibrated to meet specific dielectric strength requirements (Hi-POT)
  • Multi-layer assembly with interlayer insulation positioning based on thermal and electrical specifications


Implementation Sectors

The multilayer laminate busbars are utilized across multiple industrial sectors:

  • Medical Imaging (MRI, CT scans)
  • Renewable Energy Generation (Wind and Solar)
  • Power Electronics Systems
  • Aerospace Applications
  • Defense Systems
  • Transportation Infrastructure

Technical Functions 

  • Capacitor Link Interconnections
  • DC Link Systems
  • IGBT Power Module Integration
  • Power and Measurement Component Assembly
  • High Current Inductor Circuits

Technical Specifications Design Parameters

  • Configurable current capacity based on conductor cross-section
  • Voltage isolation ratings determined by insulation specifications
  • Thermal performance optimized through material selection
  • Mechanical strength verified through standardized testing
  • EMI characteristics engineered through geometric design

Related

Source: Exxelia

Recent Posts

Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
12
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
36
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
43
YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

YAGEO Unveils Multilayer Piezoelectric Actuators

5.10.2026
23
YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

1.10.2026
53
Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

Isabellenhütte Introduces Flexible Heaters for Space Thermal Control

1.10.2026
41
schurter-tcsv4-side-actuated-smt-tactile-switch

SCHURTER Introduces Side-Actuated SMT Tactile Switch

25.9.2026
10
Littelfuse AK-FL FlatSuppressX axial-leaded bidirectional TVS diodes for high-voltage aviation DC power protection

Littelfuse AK-FL TVS Diodes for Aviation DC Power Rails

24.9.2026
23
Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

17.9.2026
16

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved